Internship - Reliability of Advanced Semiconductor Packages

NXP Semiconductors; Nijmegen; On-site; EUR 8,900 - 13,000; Full time

Job summary

NXP Semiconductors in the Netherlands seeks a motivated MSc student to investigate the reliability of advanced laminate-based electronic packages with complex multi-material interfaces. You will examine humidity and thermo-mechanical effects and apply failure analysis to understand degradation mechanisms in automotive and industrial contexts.

The role involves driving reliability qualification activities, supporting failure analysis across development stages, and implementing robust test

Qualifications

• Internship for Master of Science in Microelectronics.
• Affinity with semiconductor, reliability and physics.
• Team player, willing to work in international and multi-disciplinary teams.
• Excellent communication skills, both verbal and written in English.

Responsibilities

• Drive product qualification and reliability assessment for new technology developments.
• Support failure analysis and root cause understanding across development and qualification phases.
• Define and implement reliability test methods, hardware, and evaluation strategies.
• Enable continuous improvement of product robustness through data-driven insights and collaboration.

Skills

Semiconductor

Reliability physics

English communication

Education

Master of Science in Microelectronics

Job description

Understanding the reliability of advanced laminate-based electronic packages at NXP

We are looking for a highly motivated student that will help us with investigating and understanding the boundaries of the reliability of advanced laminate-based electronic packages with complex multi-material interfaces. These packages may be exposed to humidity with electrical bias and/or thermo-mechanical loading over long durations. It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g. automotive and industrial).

It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g. automotive and industrial).

Your team

• Drive product qualification and reliability assessment for new technology developments.
• Support failure analysis and root cause understanding across development and qualification phases.
• Define and implement reliability test methods, hardware, and evaluation strategies.
• Enable continuous improvement of product robustness through data-driven insights and collaboration.

What’s In It For You

• A great opportunity to develop your skills (technical, soft skills, communication, etc.).
• Gaining experience in a multinational and diverse environment.
• Working on real assignments which contribute to NXP’s objectives.

Your Profile

• Internship for Master of Science in Microelectronics
• Affinity with semiconductor, reliability and physics.
• Team player, willing to work in international and multi-disciplinary teams.
• Flexible and able to multi-task.
• Excellent communication skills, both verbal and written in English.

More information about NXP in the Netherlands...