Director, Process Engineering – Advanced Packaging (Customer-Facing) | Singapore

Space Executive; Noord-Holland; On-site; EUR 182,000 - 294,000; Full time

Benefits offered by this job

Relocation assistance

Job summary

Space Executive is looking for a senior technical leader to head its advanced packaging process team in Singapore. You will be the go-to expert for strategic semiconductor customers and lead a team that ensures peak yield on critical packaging processes.

You will drive process development, integration, qualification and production ramp, while coordinating with engineering, product development, service and business teams to resolve issues and share learnings globally.

Qualifications

• 15+ years in semiconductor with advanced packaging expertise.
• Experience leading teams through middle management to executive level.
• Master’s or PhD preferred in related engineering field.

Responsibilities

• Lead 10+ engineers and managers on-site to support key customers.
• Escalate complex process issues with RCA/DOE/SPC and failure analysis to improve yield.
• Develop and optimize advanced packaging flows from development to production ramp.

Skills

Advanced packaging

Process development

DOE

SPC

Root cause analysis

Team leadership

Customer engagement

Education

Master’s degree or PhD preferred

Job description

Our client, a leading global player in the semiconductor ecosystem, is looking for a senior technical leader to head its advanced packaging process team in Singapore. You’ll be the go-to expert for strategic semiconductor customers and lead a team that keeps their advanced packaging processes running at peak yield.

What you’ll do

• Lead a team of 10+ engineers and managers who support key customers on-site.
• Act as the final escalation point for complex process issues, using root cause analysis, Design of Experiments (DOE), statistical process control (SPC) and failure analysis to drive yield improvement.
• Work with strategic customers to develop and optimise advanced packaging process flows, from process development and integration through qualification and production ramp.
• Lead technical evaluations, proof-of-concept activities and joint development programs on next-generation packaging technologies.
• Coordinate across engineering, product development, service and business teams to resolve issues fast and share learnings globally.
• Bring the voice of the customer back into product and technology roadmaps.
• Represent the business in senior and executive-level customer discussions.

What we’re looking for

• 15+ years in the semiconductor industry, with deep hands-on experience in advanced packaging process development, process integration or customer engineering.
• Strong knowledge of technologies such as wafer-level packaging, Fan-Out, RDL, TSV, bumping, hybrid bonding, CoWoS, 2.5D/3D integration, heterogeneous integration, electroplating and CMP.
• Background from a semiconductor equipment supplier, foundry, IDM or OSAT. Chipmaker backgrounds are very welcome.
• Experience leading teams through middle managers, as a current Director or a Senior Manager ready for the next step.
• Degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering or a related field. Master’s or PhD preferred.

Location and package

This role is based in Singapore. Relocation support is available for overseas candidates (relocation allowance, temporary accommodation and shipment support). Please note it’s a local package, not a full expat package.