Senior Wirebond Process Engineer - High-Impact Role

Michael Page International (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 90,000 - 120,000; Full time

Job summary

Michael Page International (Malaysia) Sdn Bhd is seeking an experienced Assembly Wirebond Process Engineer to support high-volume semiconductor manufacturing. You will develop, qualify, and optimise wirebond processes to improve yield, productivity, and reliability.

This role involves troubleshooting, process qualification, data analysis, and driving continuous improvement initiatives across production, quality, and engineering teams.

Qualifications

• Bachelor's degree in Electrical/Mechanical/Chemical/Materials Science or related field.
• Minimum 5 years in semiconductor wirebond process engineering.
• Hands-on experience with KNS and ASM wirebond equipment.
• Strong understanding of wirebond process optimisation and manufacturing controls.
• Knowledge of SPC, engineering change management, and release methodologies.
• Proven experience in yield improvement, quality improvement, and root cause analysis.

Responsibilities

• Support daily manufacturing operations and ensure stable wirebond performance.
• Develop, qualify, and optimise wirebond processes to improve yield and reliability.
• Create and maintain automated wirebond programmes and optimize wedge bonding parameters.
• Perform process characterisation, experimentation, validation, and capability studies.
• Analyse data to identify improvements and implement corrective actions.
• Lead root cause investigations for process-related issues and yield losses.
• Establish SPC methodologies and monitoring strategies.
• Develop technical documentation, process specs, and work instructions.
• Support equipment qualification, start-ups, transfers, and ramp activities.
• Drive continuous improvement projects focused on cost reduction and efficiency.
• Collaborate with production, quality, equipment engineering, and cross-functional teams.
• Support new product introductions and transitions into production.

Skills

Wirebond optimisation

Data interpretation

Root cause analysis

Problem solving

Communication

Stakeholder management

Education

Bachelor's degree

Tools

KNS equipment

ASM equipment

Job description

Michael Page International (Malaysia) Sdn Bhd is seeking an experienced Assembly Wirebond Process Engineer to support high-volume semiconductor manufacturing. You will develop, qualify, and optimise wirebond processes to improve yield, productivity, and reliability.

This role involves troubleshooting, process qualification, data analysis, and driving continuous improvement initiatives across production, quality, and engineering teams.