AI Wire Bond Process Engineer - FOL

Carsem; Ipoh; On-site; MYR 60,000 - 90,000; Full time

Job summary

Carsem in Ipoh, Malaysia seeks a hands-on Engineer to monitor bonding yield and drive improvements across process robustness, tooling, and customer interfaces. You will run DOE, analyze defects, optimize bonding recipes, and standardize practices to meet internal and customer specs.

You will collaborate with Quality, Production, Maintenance, and Engineering, providing guidance, training, and data-driven reports to support audits and continuous cost reductions.

Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related).
• Experience in semiconductor assembly, wedge bonding or wire bonding.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Good communication skills for customer interaction and reporting.

Responsibilities

• Monitor and analyze bonding yield, identifying root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methodologies (8D, FMEA, DOE).
• Establish and maintain key process control parameters and ensure compliance in production.
• Drive continuous yield improvement to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).
• Improve process stability and robustness against material and environmental variations.
• Conduct Design of Experiments (DOE) to validate process changes and improvements.
• Implement process standardization and best practices across production lines.
• Study and monitor bonding tool life performance and wear-out mechanisms.
• Define tool life criteria, replacement frequency, and optimization strategies.
• Collaborate with equipment and maintenance teams to ensure machine performance and uptime.
• Support equipment troubleshooting and qualification.
• Respond to customer inquiries, complaints, and technical requests in a timely manner.
• Perform failure analysis and provide clear, data-supported reports to customers.
• Participate in customer audits, technical reviews, and meetings as required.
• Ensure alignment of process capability with customer specifications and requirements.
• Maintain accurate process documentation, work instructions, and specifications.
• Prepare technical reports, yield analysis, and improvement updates.
• Ensure compliance with quality management systems and industry standards.
• Work closely with Quality, Production, Maintenance, and Engineering teams.
• Provide technical training and guidance to operators and technicians.
• Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

Skills

Bonding yield analysis

DOE

FMEA

SPC

Process control

Quality systems

Customer communication

Education

Bachelor’s degree in Engineering

Tools

Minitab

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Monitor and analyze bonding yield, identifying root causes of defects and yield loss.

Lead yield improvement activities using structured problem-solving methodologies (e.g., 8D, FMEA, DOE).

Establish and maintain key process control parameters and ensure compliance in production.

Drive continuous yield improvement to meet internal targets and customer expectations.

2. Process Robustness & Improvement

Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).

Improve process stability and robustness against material and environmental variations.

Conduct Design of Experiments (DOE) to validate process changes and improvements.

Implement process standardization and best practices across production lines.

3. Tooling & Equipment Management

Study and monitor bonding tool (capillary/wedge) life performance and wear-out mechanisms.

Define tool life criteria, replacement frequency, and optimization strategies.

Collaborate with equipment and maintenance teams to ensure machine performance and uptime.

Support equipment troubleshooting and qualification.

4. Customer Support & Technical Interface

Respond to customer inquiries, complaints, and technical requests in a timely manner.

Perform failure analysis and provide clear, data-supported reports to customers.

Participate in customer audits, technical reviews, and meetings as required.

Ensure alignment of process capability with customer specifications and requirements.

5. Documentation & Reporting

Maintain accurate process documentation, work instructions, and specifications.

Prepare technical reports, yield analysis, and improvement updates.

Ensure compliance with quality management systems and industry standards.

6. Cross-Functional Collaboration

Work closely with Quality, Production, Maintenance, and Engineering teams.

Provide technical training and guidance to operators and technicians.

Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

TECHNICAL SKILLS & COMPETENCIES

Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field).

Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.

Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).

Familiarity with bonding equipment and materials (Al wire, substrates, etc.).

Good communication skills for customer interaction and reporting.