Assembly Process Engineer

ASE Electronics Malaysia; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Benefits offered by this job

Annual Leave

Medical and Hospitalisation Leave

EPF

SOCSO

Annual Bonus

Medical Insurance

Job summary

ASE Electronics Malaysia is seeking a Wire Bond Engineer to design, develop and optimize wire bond processes for high-yield manufacturing. The role focuses on delivering quality while meeting delivery goals, with close collaboration across production, QA and engineering teams.

The candidate should have a degree in Electronics or Electrical Engineering and Mechanical discipline, plus solid knowledge of electronics/semi conductors and quality tools.

Qualifications

• Must have degree in Electronics/Electrical Engineering and Mechanical or equivalent.
• Solid knowledge of electronics/semiconductors and related quality tools (SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan).
• Experience with working instructions and predictive maintenance is a plus.

Responsibilities

• Develop, design, and optimize processes in manufacturing to achieve delivery goals and quality.
• Monitor and evaluate processes; provide disposition for product and process issues.
• Investigate failures, assess damage, and determine implications for process handling materials defects or equipment trouble.
• Support on-line troubleshooting and line technical issues; liaise with production, QA and support groups.

Skills

Basic technical knowledge in Electron­

Familiar with SPC FMEA DOE TPM OCAP JP

Education

Degree in Electronics/Electrical Engineering and Mechanical or equivalent

Job description

Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.

Basic technical knowledge in Electronic/Semiconductors. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.

Job Overview

Wire bond Engineer is responsible for designing, developing and optimizing process for manufacturing to achieve delivery goals and quality.

Requirements

• Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
• Basic technical knowledge in Electronic/Semiconductors. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.

Responsibility

• Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
• Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
• Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.
• Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
• Interfaces with personnel on production, QA and other support groups regarding product/process related problems and disposition.
• Prepares the necessary process instruction and conduct training to the floor member.
• Review process requirements, customers specifications and standard.
• Drive cost reduction project or second source program.
• Liaise with customer on matters related to yield, quality, etc

Benefits

• Annual Leave
• Medical and Hospitalisation Leave
• EPF
• SOCSO
• Annual Bonus
• Medical Insurance