Thermal & Mechanical Program Manager — Lead HW Integration

Advanced Micro Devices, Inc.; George Town; Vor Ort; MYR 120.000 - 210.000; Vollzeit

Zusammenfassung

AMD in Penang, Malaysia seeks a senior hardware engineer to lead thermal, mechanical and advanced board-assembly development from requirements through engineering builds and production ramp. You will connect package, board, cooling and chassis interfaces to support schedules, with regional travel to supplier sites.

The role requires strong cross-functional collaboration, the ability to challenge assumptions, and clear communication with engineers and executives.

Qualifikationen

• Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering (or equivalent).
• Experience leading complex cross-functional programs from requirements to production ramp.
• Understanding SMT/large BGA assembly challenges and package-to-system heat path is advantageous.

Aufgaben

• Define program scope, milestones, owners and acceptance criteria.
• Build integrated schedules and manage critical paths, resources and budgets.
• Coordinate interfaces across package, board, chassis, including thermal and mechanical requirements.
• Lead reviews with cooling suppliers, CMs, ODMs and OSATs; track specs, tooling and capacity.
• Plan engineering builds and drive entry/exit decisions at milestones.
• Coordinate deliverables for advanced SMT and large BGA assembly; manage defects and rework.
• Manage risks, issues and changes; present recovery options with schedule and cost impact.

Kenntnisse

Thermal hardware

Mechanical hardware

Electronics NPI

Cross-functional leadership

Technical communication

Risk assessment

Ausbildung

Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering

Tools

DOE

8D

FMEA

Power BI

SQL

Python

Jobbeschreibung

AMD in Penang, Malaysia seeks a senior hardware engineer to lead thermal, mechanical and advanced board-assembly development from requirements through engineering builds and production ramp. You will connect package, board, cooling and chassis interfaces to support schedules, with regional travel to supplier sites.

The role requires strong cross-functional collaboration, the ability to challenge assumptions, and clear communication with engineers and executives.