Senior Post-Silicon Power & Thermal Debug Engineer

Advanced Micro Devices

Penang

Hybrid

MYR 120,000 - 180,000

Full time

14 days+
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Benefits offered by this job

AMD Benefits

Job summary

AMD in Penang, Malaysia is seeking a Technical, hands-on engineer to own post-silicon validation and debug for Data Center GPU products. You will manage end-to-end PTVF characterization, power/thermal performance, and test coverage across DVFS states and real workloads.

Responsibilities include defining robust test plans, deep-dive root-cause analysis across silicon, firmware, and platform, and collaborating with design and manufacturing to improve yield and reliability for volume production.

Qualifications

  • Bachelor’s degree in Electrical/Computer Engineering or related field with 5–7 years of SoC thermal validation and debug.
  • Strong post-silicon debugging skills across silicon, firmware and system levels.
  • Experience with high‑volume manufacturing test and coverage optimization.

Responsibilities

  • Define and deploy post-silicon test plans for power, thermal, voltage, and frequency conditions.
  • Lead deep-dive debugging of failures across silicon, firmware and platform.
  • Optimize PPA coverage to meet performance while maintaining thermal/power limits.
  • Validate DVFS states, thermal corners, and real-world workloads for robust operation.
  • Drive data-driven yield and quality improvements with cross‑functional teams.

Skills

Post-Silicon Debug
PPA Knowledge
DVFS
Lab Debug
Linux
Python Bash
Data Analytics

Education

Bachelor's degree in Electrical/Computer Engineering or related with 5-7 years experience

Tools

ATE
Telemetry
Python scripting

Job description

AMD in Penang, Malaysia is seeking a Technical, hands-on engineer to own post-silicon validation and debug for Data Center GPU products. You will manage end-to-end PTVF characterization, power/thermal performance, and test coverage across DVFS states and real workloads.

Responsibilities include defining robust test plans, deep-dive root-cause analysis across silicon, firmware, and platform, and collaborating with design and manufacturing to improve yield and reliability for volume production.

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