Thermal & Mechanical Engineering Program Lead

AMD; Penang; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD is seeking a seasoned engineer to lead thermal, mechanical, and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and ramp. You will connect package, board, cooling and chassis integration to support the product schedule, with regional travel to supplier sites and engineering builds.

The role requires an individual contributor with the depth to challenge assumptions while coordinating with engineering owners and

Qualifications

• Substantial experience in thermal/mechanical hardware or electronics NPI.
• Delivery from engineering development through production ramp.
• Working knowledge of SMT processes and large BGA challenges is advantageous.

Responsibilities

• Define program scope, milestones, owners and acceptance criteria; build schedules and manage budgets.
• Coordinate interfaces (package, board, chassis) and assess design-change impact.
• Lead reviews with cooling suppliers, CMs, ODMs and OSATs; track specs and tooling.

Skills

Thermal engineering

Mechanical hardware

Cross-functional leadership

Executive communication

Program management (phase-gate)

Education

Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering

Tools

DOE

FMEA

Power BI

SQL

Python

Job description

AMD is seeking a seasoned engineer to lead thermal, mechanical, and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and ramp. You will connect package, board, cooling and chassis integration to support the product schedule, with regional travel to supplier sites and engineering builds.

The role requires an individual contributor with the depth to challenge assumptions while coordinating with engineering owners and