Senior System Thermal Design Lead - AI & Data Center

Advanced Micro Devices, Inc.

George Town

Hybrid

MYR 180,000 - 280,000

Full time

5 days ago
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Benefits offered by this job

AMD benefits

Job summary

AMD in Penang, Malaysia, is seeking a System Thermal Design Staff Engineer to lead thermal design and validation for next-gen server, AI, and datacenter platforms.

This role requires strong hands-on capability in CPU/GPU thermal design, characterization, platform-level optimization, and managing ODM engineering execution, with cross-functional collaboration across BIOS, power, mechanical, and architecture teams.

Qualifications

  • 8+ years of thermal engineering experience in server/datacenter platforms.
  • Proven leadership in ODM/OEM thermal projects.
  • Experience with FloTHERM and ANSYS Icepak for CFD and thermal simulations.
  • Strong debugging, root-cause analysis, and cross-functional collaboration.

Responsibilities

  • Lead system-level thermal design and validation for CPU/GPU server and AI platforms.
  • Develop and execute thermal validation plans, methodologies, and design strategies.
  • Drive thermal characterization across workloads, configurations and environments.
  • Lead thermal issue debugging, root-cause analysis, and corrective actions.
  • Collaborate with BIOS, power, SI/PI, mechanical, platform, architecture, and other teams.
  • Drive fan tuning, airflow optimization, and overall system thermal performance.
  • Mentor junior engineers and drive improvement in methodologies.

Skills

Thermal design
System-level design
ODM collaboration
CFD correlation
Thermal validation
Thermal testing
Thermal instrumentation
Leadership

Education

Bachelor's/Master's in Mechanical or Thermal Engineering

Tools

FloTHERM
ANSYS Icepak

Job description

AMD in Penang, Malaysia, is seeking a System Thermal Design Staff Engineer to lead thermal design and validation for next-gen server, AI, and datacenter platforms.

This role requires strong hands-on capability in CPU/GPU thermal design, characterization, platform-level optimization, and managing ODM engineering execution, with cross-functional collaboration across BIOS, power, mechanical, and architecture teams.

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