Sustaining Package Engineer for AI Mass Production & COGS

Renesas Electronics Corporation; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics Corporation in Penang, Malaysia is seeking a Sustaining Staff Package Engineer to ensure long-term quality and manufacturability of power IC products. You will manage SPS, controllers and AI product lifecycles in a high-volume manufacturing environment.

You will collaborate with design, test, manufacturing, package and quality teams to sustain products, resolve issues, and drive package design improvements and COGS reduction.

Qualifications

• Minimum 5 years in package development and/or process engineering.
• Bachelor's degree in Mechanical, Electrical/Electronic, Physics, Materials or related field.
• Experience in ramp execution, BOM readiness, capacity planning, and process optimization.
• Experience in CuClip thin die assembly and SPS solder attach processes.
• Strong data manipulation and analysis skills; English proficiency; onsite work required.

Responsibilities

• Own lifecycle management for multiple products.
• Ensure readiness of high-volume AI product assembly lines.
• Monitor and resolve manufacturing issues with fab, assembly and test sites.
• Drive COGS improvements and process optimization (yield, test time, failures).
• Manage MRB/PCRB risk and support qualifications and changes.
• Cross-functional collaboration with Ops, QA, Reliability, Factory and OSAT.

Skills

Package development

Process engineering

Product ramp

Data analysis

Communication skills

On-site work

English proficiency

Education

Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Physics / Materials)

Tools

JMP

PDF Exenso

Job description

Renesas Electronics Corporation in Penang, Malaysia is seeking a Sustaining Staff Package Engineer to ensure long-term quality and manufacturability of power IC products. You will manage SPS, controllers and AI product lifecycles in a high-volume manufacturing environment.

You will collaborate with design, test, manufacturing, package and quality teams to sustain products, resolve issues, and drive package design improvements and COGS reduction.