Power QFN Process Engineer - Assembly & Process Improvements

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 100,000 - 167,000; Full time

Job summary

Renesas Electronics Corp. in Penang, Malaysia is seeking an experienced Package and Assembly Engineer to qualify PQFN packages for SPS products, sustain line operations, and drive process improvements from NPI to mass production.

You will collaborate with Test, Product, Quality and Operations to improve yield, cost and capacity while managing supplier changes. The role requires a degree in a related field, 5+ years in assembly engineering, experience with PQFNs/WLCSP, and knowledge of wire

Qualifications

• Bachelor's degree in a relevant field and solid grounding in manufacturing.
• Minimum 5 years of experience in Assembly Engineering.
• Experience in process engineering or package development for thin wafer handling and SPS solder attach processes.
• Knowledge of PQFN/QFN/WLCSP and leaded packages quality/reliability requirements.
• Knowledge of wire bonding and SPC with statistical tools.
• Strong English communication and teamwork skills.

Responsibilities

• Design package and develop processes to qualify PQFN packages for SPS products and modules.
• Ramp up manufacturing volume and qualify sources.
• Sustain line performance by improving yield, capacity, quality and costs.
• Collaborate with Test, Product, Quality and Operations to address feedback and issues.
• Manage Product Lifecycle Management documents to current status.
• Lead change-management with suppliers for capacity and cost improvements.
• Partner with Quality and Reliability to meet industry standards.
• Act as the manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships.

Skills

English communication

Project management

Analytical skills

Written communication

Presentation skills

Wire bonding

Education

Degree in Mechanical/Materials/Physics/Chemistry/Applied Sciences

Tools

JMP

Job description

Renesas Electronics Corp. in Penang, Malaysia is seeking an experienced Package and Assembly Engineer to qualify PQFN packages for SPS products, sustain line operations, and drive process improvements from NPI to mass production.

You will collaborate with Test, Product, Quality and Operations to improve yield, cost and capacity while managing supplier changes. The role requires a degree in a related field, 5+ years in assembly engineering, experience with PQFNs/WLCSP, and knowledge of wire