Staff Process Engineer

JAC Recruitment International; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

JAC Recruitment International is assisting a leading global semiconductor organization in Penang to fill a Staff Process Engineer role focused on advanced packaging development and high-volume manufacturing for power semiconductor products. The position centers on PQFN and Cu clip-based thin die assembly, with duties spanning new product introduction and sustaining engineering.

Responsibilities include leading PQFN package development, optimizing assembly processes, ramping up high-volume

Qualifications

• Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences (or related discipline).
• Proven experience in semiconductor process engineering or advanced packaging development.
• Strong experience with PQFN, QFN, WLCSP, or similar package technologies.
• Knowledge of thin wafer handling, die attach, and Cu clip assembly processes (especially for power devices).
• Understanding of quality and reliability requirements for semiconductor packaging.
• Hands-on experience with statistical process control (SPC) and data analysis tools (e.g., JMP).
• Strong problem-solving, analytical, and project management skills.
• Effective communication and stakeholder management skills in a cross-functional environment.
• Ability to manage complex projects and drive outcomes in a fast-paced manufacturing environment.

Responsibilities

• Lead package development and process qualification for PQFN (Power Quad Flat No-Lead) packages and Smart Power Stage (SPS) products.
• Develop and optimize assembly processes for thin wafer handling, die attach, and Cu clip technologies.
• Drive high-volume manufacturing ramp-up and qualify new production sources to meet capacity and demand requirements.
• Own sustaining engineering activities, continuously improving yield, quality, capacity, and cost performance.
• Collaborate with Product, Test, Quality, and Operations teams to resolve internal and customer-reported issues.
• Lead root cause analysis and implement corrective and preventive actions for process-related challenges.
• Manage and maintain Product Lifecycle Management (PLM) documentation to ensure accuracy and compliance.
• Drive suppliers change management initiatives to improve manufacturing robustness, scalability, and cost efficiency.
• Apply statistical methods (SPC, data analysis) to monitor performance and drive continuous improvements.

Skills

Semiconductor process

Advanced packaging

Process qualification

PQFN experience

SPC analysis

Data analysis

Root cause analysis

Project management

Cross-functional teamwork

Communication skills

Supplier management

Education

Bachelor's degree

Tools

JMP

Job description

A leading global semiconductor organization is seeking a Staff Process Engineer to drive advanced packaging development and high-volume manufacturing for power semiconductor products. This role focuses on Power QFN (PQFN) and Cu clip-based thin die assembly processes, supporting both new product introduction and sustaining engineering. You will play a critical role in optimizing assembly processes, improving yield and cost efficiency, and ensuring robust production performance while collaborating closely with cross-functional teams and external manufacturing partners.

Responsibilities

• Lead package development and process qualification for PQFN (Power Quad Flat No-Lead) packages and Smart Power Stage (SPS) products.

• Develop and optimize assembly processes for thin wafer handling, die attach, and Cu clip technologies.

• Drive high-volume manufacturing ramp-up and qualify new production sources to meet capacity and demand requirements.

• Own sustaining engineering activities, continuously improving yield, quality, capacity, and cost performance.

• Collaborate with Product, Test, Quality, and Operations teams to resolve internal and customer-reported issues.

• Lead root cause analysis and implement corrective and preventive actions for process-related challenges.

• Manage and maintain Product Lifecycle Management (PLM) documentation to ensure accuracy and compliance.

• Drive suppliers change management initiatives to improve manufacturing robustness, scalability, and cost efficiency.

• Apply statistical methods (SPC, data analysis) to monitor performance and drive continuous improvements.

Requirements

• Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences (or related discipline).

• Proven experience in semiconductor process engineering or advanced packaging development.

• Strong experience with PQFN, QFN, WLCSP, or similar package technologies.

• Knowledge of thin wafer handling, die attach, and Cu clip assembly processes (especially for power devices).

• Understanding of quality and reliability requirements for semiconductor packaging.

• Hands-on experience with statistical process control (SPC) and data analysis tools (e.g., JMP).

• Strong problem-solving, analytical, and project management skills.

• Effective communication and stakeholder management skills in a cross-functional environment.

• Ability to manage complex projects and drive outcomes in a fast-paced manufacturing environment.