Staff Process Engineer

Renesas Electronics Corporation; Shah Alam; On-site; MYR 134,000 - 268,000; Full time

Job summary

Renesas Electronics Corporation in Malaysia is seeking a manufacturing engineer to qualify PQFN packages for SPS products and related modules. You will design packaging, develop qualification processes, and ramp up production while optimizing yield, capacity, quality, and cost.

You will collaborate with Test, Product, QA and Operations teams to address feedback, manage lifecycle documents, and coordinate with OSAT and contract manufacturers for smooth NPI-to-production transfers.

Qualifications

• Bachelor degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.
• Knowledge of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Responsibilities

• Design package and develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers
• Manage OSAT and contract manufacturing relationships supporting production

Skills

Process engineering

PQFN knowledge

Wire bonding

SPC

JMP

English fluency

Project management

Education

Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences

Job description

Job Description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers
• Manage OSAT and contract manufacturing relationships supporting production

Qualifications

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
• Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and statistical analysis software (such as JMP).
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.
• Following merits will be assessed in interviews:
  • i) High sense of responsibility
  • (ii) Able to work with people of all levels
  • (iii) Able to work with minimal supervision
  • (iv) Self-motivated and Self-disciplined

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.