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Renesas Electronics is seeking a Manufacturing Engineer to qualify PQFN packages and support SPS product lines. You will design packages, develop processes, and ramp up volume while collaborating with Test, Product, Quality and Operations.
You will manage OSAT and contract manufacturers, maintain PLM documents, conduct supplier change-management, and drive improvements in yield, cost, and capacity. Strong English communication and technical background required.
Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Key Responsibilities
Nice to haves:
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .