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Carsem is seeking an engineer to support EOL and NPI initiatives in semiconductor packaging. You will review BOM, flow charts, and packaging specs, and coordinate cross-functional teams to meet project milestones.
Responsibilities include RFQ reviews, customer calls, data analysis, and generating validation reports to ensure on-time release and target yields of 98.5% or higher.
Review RFQ prepared by Project Management (PM) team – on EOL technical related item.
Review TGA – on EOL related item.
Attend con-call with customer and share project / action item updates.
Liaise with internal cross functional department, supplier and customer on EOL related items.
Support on EOL related item:
- BOM / Plan ID / Flow chart review and approval.
- Update Package packing spec and tool buyoff (Pick and Place / Laser Mark / Mold / etc)
Support new product introduction (NPI), process transfer, and mass production
Prepare Eng Validation and / or Qual report for NPI / newly develop package.
Process monitoring and enhancement to ensure NPI / newly develop project meet yield target of min 98.5%.
Work pro-actively with FOL NPI team / Package Development team / EOL Technician in order to ensure project run smoothly and released on time.
Liaise with respective cross-functional groups: PM / Planner / QA / Prod / Process / Maintenance / Tooling department in order to ensure builds are completed on time.
EOL Process (Mold / Laser Mark / Singulation / Pick & Place) knowledge is an advantage
Data Collection, organization and interpretation data to support decision-making
Ability to analyze product excursions and drive corrective actions.
Use of statistical tools (SPC, DOE, FMEA, Six Sigma).
Ramp-to-yield entitlement management.
Continuous improvement in cycle time, yield, and product quality.
Bachelor's Degree in Engineering (Electrical, Electronics, Mechatronics, Manufacturing, Mechanical, or related discipline).
Experience in semiconductor manufacturing, assembly, test, or NPI environment is an added advantage.