Senior Wafer Sawing Engineer

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 89,000 - 134,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia, seeks an Equipment Operations & Troubleshooting Engineer to lead a team of Technicians in engineering activities and ensure wafer saw quality meets spec.

You will drive process improvements, support new devices, attend customer meetings and audits, and uphold 5S and quality compliance in a fast paced semiconductor environment. This is a hands-on role requiring strong problem solving and teamwork.

Qualifications

• Degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering discipline.
• 3–5 years' experience in semiconductor manufacturing, particularly wafer sawing/dicing.
• Hands-on experience with Disco wafer saw machines preferred.
• Familiar with DOE methodologies and automation/equipment troubleshooting.
• Exposure to IoT-based monitoring and predictive maintenance is a plus.
• Strong understanding of cleanroom protocols and wafer contamination control.
• Proven ability in failure analysis and root cause investigation to resolve equipment issues.
• Good understanding of quality compliance, 4M analysis, and customer audit requirements.

Responsibilities

• Supervise and guide a team of Technicians on Engineering activities
• Oversee CSMO wafer saw quality and issues
• Troubleshoot technical issues through 4M analysis
• Conduct root cause analysis and implement corrective actions to resolve recurring equipment failures
• Establish critical process parameters for new devices or new customers
• Drive continuous improvements, e.g. through Automation and SOP enhancement
• Attend customer meetings and audits
• Minimize customer complaints, both internal and external (VOC, VOP), and manage MRB
• Ensure quality accountability and compliance to spec with continuous enhancement
• Involvement in 5S initiatives
• Perform any other duties as assigned by immediate superior

Skills

4M analysis

DOE methodologies

Automation troubleshooting

Root cause analysis

Quality compliance

Communication

Time management

Education

Engineering degree (Mechanical / Electrical / Electronic / Mechatronics)

Tools

Disco wafer saw

Job description

1) Equipment Operations & Troubleshooting

Supervise and guide a team of Technicians on Engineering activities

Oversee CSMO wafer saw quality and issues

Troubleshoot technical issues through 4M analysis

Conduct root cause analysis and implement corrective actions to resolve recurring equipment failures

2) Process & Technical Support

Establish critical process parameters for new devices or new customers

Drive continuous improvements, e.g. through Automation and SOP enhancement

Attend customer meetings and audits

Minimize customer complaints, both internal and external (VOC, VOP), and manage MRB

3) Compliance & Continuous Improvement

Ensure quality accountability and compliance to spec with continuous enhancement

Involvement in 5S initiatives

Perform any other duties as assigned by immediate superior

Requirements:

Degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering discipline (any engineering background accepted with relevant experience)

Minimum 3–5 years' experience in semiconductor manufacturing, particularly in wafer sawing/dicing processes

Hands-on experience with Disco wafer saw machines is preferred

Familiar with Design of Experiments (DOE) methodologies and automation/equipment troubleshooting

Exposure to IoT-based monitoring and predictive maintenance solutions is a plus

Strong understanding of cleanroom protocols and wafer contamination control

Proven ability in failure analysis and root cause investigation to resolve equipment issues

Good understanding of quality compliance, 4M analysis, and customer audit requirements (VOC/VOP)

Strong problem-solving, communication, and time management skills

Hands-on, proactive, and able to work both independently and in a team

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, \"state of the art\" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

\"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World\"

MISSION

\"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice\"

QUALITY

Carsem's policy is to provide products and services of the highest quality through \"ZERO DEFECTS TODAY!\", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, \"state of the art\" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

\"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World\"

MISSION

\"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice\"

QUALITY

Carsem's policy is to provide products and services of the highest quality through \"ZERO DEFECTS TODAY!\", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

• Medical


• Education support


• Dental


• Parking


• Medical for immediate family members


• Car subsidy