Project Manager Project Management

Infineon Technologies AG; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Senior Project Manager to drive package assembly and test development within the CSS division, liaising with global subcontractors.

You will lead initiation, planning, and execution of low to medium complexity projects, drive cost-down initiatives, manage risks, and coordinate cross-functional teams across locations to ensure on-time, on-budget delivery of power/packaging solutions.

Qualifications

• Master's or Bachelor's in Electrical / Electronic Engineering / Mechanical/Material Science
• Minimum 5 years in relevant industry experience, ideally with Semiconductor Pre-assembly, Assembly and Test Technology exposure
• IPMA-C certification in project management is preferred
• In-depth knowledge of project management with experience leading cross-functional projects in an international environment
• Attention to detail and ability to solve complex problems in heterogeneous teams

Responsibilities

• Drive package definition, technology integration and requirements engineering as part of the project initiation process.
• Initiation, planning, execution, control and closure of package assembly and test development and global change management projects.
• Lead low to medium complexity projects per classification guidelines and manage scope, budget and timeline.
• Identify package level cost down opportunities and drive cost-down projects.
• Apply Infineon’s processes, milestones, tools and methods to structure projects and manage risks/changes.
• Drive major milestone release decisions in project reviews and approvals.
• Collaborate with cross-functional teams across locations to solve problems and find innovative solutions.
• Coordinate alignment of Subcon Technology roadmaps with PTI function and map to in-house capabilities.
• Support ramp-up and transition into serial production; provide timely project status updates.
• Foster relationships with internal partners and subcontractors to meet organizational goals.
• Be proactive in managing deviations to avert delays and extra costs.

Skills

Project management

Cross-functional leadership

Stakeholder management

Communication skills

Education

Master's in Electrical/Electronic Engineering

Bachelor's in Electrical/Electronic Engineering

Tools

IPMA-C certification

Job description

Drive Package assembly and Test development projects under the OSAT (Outsourced Assembly & Test) function to enable turnkey/full turnkey of high volume manufacturing for Infineon's product, under Connected and Secure Systems (CSS) business division, in our subcontractors manufacturing sites present globally.

Job Description
In your new role you will:

• Drive package definition, technology integration and requirements engineering as part of the project initiation process.
• Initiation, planning, execution, control and closure of package assembly and test development as well as Global change management projects within the committed scope, budget and timeline.
• Undertake low to medium complexity projects as per the project classification and category guidelines defined by Infineon
• Identify package level cost down opportunities and drive cost down projects.
• Adapt and apply Infineon’s business process, milestones, systematics, project management tools and methods to structure the projects, control, manage risks and changes throughout the project lifecycle.
• Responsible for operational decisions in the project and for driving the major milestone release decisions in the project review and approval platform.
• Work closely with cross functional project teams from various locations, to solve complex problems and identify innovative solution.
• Co-ordinate/support alignment of Subcon Technology roadmaps with segments and representatives of Package -Technology and Innovation (PTI) function.
• Drive package platform assessment between subcons and provide mapping to in-house capability supported by the segments and package platform managers.
• Close collaboration with internal partners across various functions and regions, such as from business division, package concept engineering, procurement, IT systems enabling, engineering, planning, quality, procurement, product program management and package platform management.
• Technical ramp up management for seamless transition during new product / package ramp up phases into serial production.
• Be the driver/co-driver of task force initiatives when situation arise.
• Prepare and provide timely and adequate project status update to higher management.
• Actively manage the project and pro-actively manage potential deviations to avert delays and additional cost.
• Foster good relationship with the resource managers from both internal, subcon business partners and drive cross functional project team members from various locations and nationalities to meet the organization goals through the projects.

Your Profile
You are best equipped for this task if you have:

• Master's / Bachelor's in Electrical / Electronic Engineering / Mechanical/Material Science
• Minimum 5 years of relevant industry experience, and ideally with Semiconductor Pre-assembly, Assembly and Test Technology exposure
• In-depth knowledge in Project Management, with more than 2 years experience leading cross-functional projects of low to medium complexity in international environment and preferably with IPMA- level C certification in project management.
• Technical knowledge of various processes in semiconductor pre assembly, assembly and final test area will be an added advantage.
• An eye for details, ability to solve complex problems via shaping open mind-set and cooperation in heterogeneous teams; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information.
• Strong interpersonal communication, presentation and reasoning skills for leading and working in a matrix organization of international reach;
• Ability to build long lasting relationships and trusted partnerships with our internal stakeholders and subcon business partners.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
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