Lead Principal Engineer

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Lead Principal Engineer in its R&D team in Malaysia to drive packaging definition activities, develop package outlines and drawings, and ensure designs meet electrical, thermal, reliability, and mechanical requirements.

The role requires 7+ years in IC/semiconductor/SMT, strong SMT/packaging knowledge, and proficiency in AutoCAD/3D drafting. Join a global leader driving decarbonization and digitalization through innovative packaging solutions.

Qualifications

• Bachelor’s Degree in Engineering or related field.
• Minimum 7 years of relevant working experience in the IC, semiconductor, or SMT industry.
• Strong knowledge of SMT, semiconductor packaging, assembly and test processes.
• Knowledge of process engineering and equipment engineering principles.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Knowledge of AutoCAD and 3D drafting is preferred.

Responsibilities

• Drive technical definition activities for package projects involving major changes, new package developments, significant risks, or business impacts, including BOM preparation, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and update package drawings as required.
• Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
• Coordinate package cost estimation activities (A1-A3) and package cost indication processes (A3).
• Act as the key contact and technical consultant for package definition matters to Business Divisions, particularly in relation to backend assembly technology expertise.
• Support pre-development and project definition activities, and serve as the package design expert throughout the project lifecycle.

Skills

SMT & packaging knowledge

Process engineering principles

Failure analysis & reliability

Analytical & problem solving

AutoCAD & 3D drafting

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics)

7+ years in IC/semiconductor/SMT industry

Tools

AutoCAD

3D drafting

Job description

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks?

As a Lead Principal Engineer in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role
Key responsibilities in your new role

Drive technical definition activities for package projects involving major changes, new package developments, significant risks, or business impacts, including BOM preparation, package design, assembly technology, PRP reviews, and project classification.

Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and update package drawings as required.

Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.

Coordinate package cost estimation activities (A1-A3) and package cost indication processes (A3).

Act as the key contact and technical consultant for package definition matters to Business Divisions, particularly in relation to backend assembly technology expertise.

Support pre-development and project definition activities, and serve as the package design expert throughout the project lifecycle.

Your profile
Qualifications and skills to help you succeed

Bachelor’s Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics Engineering, or Physics.

Minimum 7 years of relevant working experience in the IC, semiconductor, or SMT industry.

Strong knowledge of SMT, semiconductor packaging, assembly, and test processes.

Knowledge of process engineering and equipment engineering principles.

Knowledge of failure analysis and reliability engineering.

Strong analytical and problem-solving skills.

Knowledge of AutoCAD and 3D drafting is preferred.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Please let your recruiter know if you need any accommodations during the interview process.