Senior PVD Sputtering Engineer – Ti/Cu Seed

AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (MALAYSIA) SDN. BHD.

Kulim

On-site

MYR 90,000 - 130,000

Full time

14 days+

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Job summary

AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (MALAYSIA) SDN. BHD. seeks a senior PVD/sputtering engineer in Kulim to develop and optimize seed metallization processes, establish film characterization, and drive defect control for manufacturability.

You will integrate sputtering with downstream steps and prepare qualification guidelines for PVD equipment and maintenance concepts. The role requires 5+ years in PVD/sputtering within semiconductor or related thin-film manufacturing, with strong

Qualifications

5+ years of relevant PVD/sputtering experience in semiconductor or related thin-film manufacturing.
Experience with seed/metals deposition and barrier-related processes is preferred.
Strong knowledge of film properties, stress and adhesion in sputtered layers.

Responsibilities

Develop and optimize seed metallization sputtering recipes to meet targets (thickness, uniformity, sheet resistance, adhesion, stress, defects).
Establish film/interface characterization methods and correlate with process conditions.
Investigate defects (adhesion, particles, arcing, non-uniformity) to protect yield.
Integrate sputtering with downstream steps to ensure manufacturable metallization flow.
Provide qualification guidelines for PVD equipment and preventive-maintenance concepts.
Drive particle and contamination control, monitor critical consumables and SPC indicators.
Prepare development and transfer documentation for pilot/HVM ramp and support the TDI team.