Senior R&D Engineer / Specialist - Ti/Cu Sputtering

AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (MALAYSIA) SDN. BHD.; Kulim; On-site; MYR 90,000 - 130,000; Full time

Job summary

AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (MALAYSIA) SDN. BHD. seeks a senior PVD/sputtering engineer in Kulim to develop and optimize seed metallization processes, establish film characterization, and drive defect control for manufacturability.

You will integrate sputtering with downstream steps and prepare qualification guidelines for PVD equipment and maintenance concepts. The role requires 5+ years in PVD/sputtering within semiconductor or related thin-film manufacturing, with strong

Qualifications

• 5+ years of relevant PVD/sputtering experience in semiconductor or related thin-film manufacturing.
• Experience with seed/metals deposition and barrier-related processes is preferred.
• Strong knowledge of film properties, stress and adhesion in sputtered layers.

Responsibilities

• Develop and optimize seed metallization sputtering recipes to meet targets (thickness, uniformity, sheet resistance, adhesion, stress, defects).
• Establish film/interface characterization methods and correlate with process conditions.
• Investigate defects (adhesion, particles, arcing, non-uniformity) to protect yield.
• Integrate sputtering with downstream steps to ensure manufacturable metallization flow.
• Provide qualification guidelines for PVD equipment and preventive-maintenance concepts.
• Drive particle and contamination control, monitor critical consumables and SPC indicators.
• Prepare development and transfer documentation for pilot/HVM ramp and support the TDI team.

Skills

PVD/sputtering

DOE

SPC/MSA/FMEA

Statistical analysis

Root-cause analysis

Film metrology

Adhesion testing

Vacuum troubleshooting

Education

Bachelor's or Master's in Materials Science/Physics/Vacuum or related

Tools

Sputtering tools

Vacuum equipment

Job description

This role involves developing and optimizing seed metallization sputtering processes, establishing film and interface characterization methods, investigating defects, and integrating sputtering with downstream processes to ensure continuous and manufacturable metallization flow. You will provide qualification guidelines for PVD equipment, drive particle and contamination control, and prepare documentation to support pilot and high-volume manufacturing ramp.

Key responsibilities

Develop and optimize seed metallization (such as Ti/Cu) sputtering recipes to meet film thickness, uniformity, sheet resistance, adhesion, stress and defect targets by controlling pre-clean, power, pressure, gas flow, deposition time and substrate handling through DOE

Establish film and interface characterization methods to verify seed/barrier integrity by correlating process conditions with thickness mapping, sheet resistance, adhesion, morphology, contamination and reliability data

Investigate defects such as poor adhesion, particles, arcing, non-uniformity, high resistance and coverage discontinuity to protect plating and electrical yield through structured chamber, target, surface and handling analysis

Integrate sputtering with PiD descum, Cu plating and Ti/Cu etching to ensure a continuous and manufacturable metallization flow by defining surface condition, seed continuity and downstream compatibility requirements

Provide qualification guideline for PVD equipment, targets, fixtures and preventive-maintenance concepts to establish safe and scalable capability by defining customer specification requirements/acceptance criteria, chamber matching and process-control plans

Drive initial particle, contamination and chamber-health control to maintain stable film quality by monitoring critical consumables, target life, shields, vacuum performance and SPC indicators

Prepare development and initial transfer documentation and act as supporting roles to TDI team in setting up pilot/HVM ramp to ensure repeatable execution by monitoring early lots and closing process deviations

About you

Bachelor's or Master's degree in Materials Science, Physics, Vacuum/Surface Engineering, Electronics, Mechanical or a comparable technical discipline

Typically 5+ years of relevant PVD/sputtering experience in semiconductor, advanced packaging, IC-substrate, display or related thin-film manufacturing; Ti/Cu seed/barrier experience is strongly preferred

Strong PVD/vacuum knowledge including plasma, target behavior, film nucleation, stress, uniformity, adhesion, contamination and particle mechanisms

Hands-on experience with sputtering tools, vacuum troubleshooting and film metrology such as thickness, sheet resistance, microscopy and adhesion testing

Understanding of dielectric surface preparation, electroplating and seed-layer etch integration is strongly preferred

Strong experimental planning, statistical analysis and structured problem-solving skills

Structured DOE, SPC, MSA, FMEA and statistical data analysis; strong root-cause and problem-solving discipline

Ability to translate product/customer requirements into measurable process specifications and acceptance criteria

AT&S is a globally leading manufacturer of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive, Industrial and Medical. AT&S has its headquarters in Austria and global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). A new high-end production site for IC substrates is currently being established in Kulim, Malaysia. In Leoben, a European competence centre including series production is being built. The company employs roughly 15,000 people. For further information please visit www.ats.net

AT&S is a globally leading manufacturer of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive, Industrial and Medical. AT&S has its headquarters in Austria and global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). A new high-end production site for IC substrates is currently being established in Kulim, Malaysia. In Leoben, a European competence centre including series production is being built. The company employs roughly 15,000 people. For further information please visit www.ats.net