Senior Process Engineer: Semiconductor Singulation Expert

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 240,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Senior Engineer Unit Process Development Singulations to shape the future of semiconductor packaging and drive readiness for high-volume manufacturing.

You will lead tape-based, tapeless, and laser singulation process development, mentor teammates, and collaborate with suppliers to implement scalable, cost-effective solutions. The role offers impact on technology roadmaps and yield improvements in a global team.

Qualifications

• Minimum 10 years of experience in semiconductor backend assembly and package development.
• Minimum 5 years of direct experience in package singulation process development.
• Tape-based singulation experience.
• Tapeless singulation experience.
• Laser singulation experience.
• Experience supporting high-volume semiconductor manufacturing environments.
• Demonstrated track record in process development, industrialization, and yield improvement.

Responsibilities

• Perform process development activities, including process parameter scouting, optimization, verification, and process freeze.
• Drive qualification and implementation of tape-based, tapeless, and laser singulation solutions.
• Generate and maintain Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.
• Support prototype and development sample builds.
• Evaluate emerging singulation technologies and establish technology readiness for deployment.
• Provide input and ensure accuracy of Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, and related documents.
• Liaise with suppliers to drive continuous improvement and verify new tooling, machines, and materials.
• Identify and develop new process technologies to meet business needs.
• Benchmark industry best practices for competitive advantage.
• Provide technical guidance and mentorship to engineers and project teams.
• Serve as primary technical expert for package singulation technology.

Skills

Semiconductor backend

Package singulation

Laser singulation

Blade dicing

Yield improvement

Problem solving

Stakeholder mgmt

Strategic thinking

Job description

Infineon Technologies AG in Malaysia seeks a Senior Engineer Unit Process Development Singulations to shape the future of semiconductor packaging and drive readiness for high-volume manufacturing.

You will lead tape-based, tapeless, and laser singulation process development, mentor teammates, and collaborate with suppliers to implement scalable, cost-effective solutions. The role offers impact on technology roadmaps and yield improvements in a global team.