Senior Semiconductor Process Engineer

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Senior Engineer to lead process development and singulation technology for high-volume semiconductor backend assembly. You will drive Tape-based, Tapeless and Laser singulation projects, coordinate with Operations, and shape process roadmaps to meet quality and cost targets.

The role requires hands-on expertise, strong analytical skills, and leadership to mentor fellow engineers while advancing new tech initiatives across development projects.

Qualifications

• Masters or Bachelors in Engineering or related field with 10+ years in semiconductor backend assembly.
• Minimum 5+ years direct experience in package singulation process development.
• Hands-on expertise in Tape-based, Tapeless and Laser singulation.
• Experience in high-volume semiconductor manufacturing environments.
• Proven track record in process development, industrialization and yield improvement.

Responsibilities

• Perform process development activities to meet timeline, quality and cost targets.
• Drive qualification and implementation of singulation technologies and solutions.
• Provide technical handshake and knowledge transfer to Operations.
• Generate and update Process Specifications, FMEA, OJTI and related documents.
• Support prototype and development samples build.
• Evaluate emerging singulation technologies for readiness.
• Update Process Roadmaps, Failure catalogs and Control Plans.
• Collaborate with suppliers for tooling, machines and materials verification.
• Identify new process technology and improve capability for business needs.
• Benchmark industry best practices and drive competitive advantage.
• Provide technical guidance to engineers and project teams.

Skills

Technical leadership

Analytical skills

Stakeholder management

Strategic thinking

Education

Masters/Bachelor's Degree in Engineering

Tools

Tape-based singulation

Tapeless singulation

Laser singulation

Blade dicing

Saw singulation

Job description

Infineon Technologies in Malaysia seeks a Senior Engineer to lead process development and singulation technology for high-volume semiconductor backend assembly. You will drive Tape-based, Tapeless and Laser singulation projects, coordinate with Operations, and shape process roadmaps to meet quality and cost targets.

The role requires hands-on expertise, strong analytical skills, and leadership to mentor fellow engineers while advancing new tech initiatives across development projects.