Senior Engineer Unit Process Development Singulations

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 240,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Senior Engineer Unit Process Development Singulations to shape the future of semiconductor packaging and drive readiness for high-volume manufacturing.

You will lead tape-based, tapeless, and laser singulation process development, mentor teammates, and collaborate with suppliers to implement scalable, cost-effective solutions. The role offers impact on technology roadmaps and yield improvements in a global team.

Qualifications

• Minimum 10 years of experience in semiconductor backend assembly and package development.
• Minimum 5 years of direct experience in package singulation process development.
• Tape-based singulation experience.
• Tapeless singulation experience.
• Laser singulation experience.
• Experience supporting high-volume semiconductor manufacturing environments.
• Demonstrated track record in process development, industrialization, and yield improvement.

Responsibilities

• Perform process development activities, including process parameter scouting, optimization, verification, and process freeze.
• Drive qualification and implementation of tape-based, tapeless, and laser singulation solutions.
• Generate and maintain Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.
• Support prototype and development sample builds.
• Evaluate emerging singulation technologies and establish technology readiness for deployment.
• Provide input and ensure accuracy of Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, and related documents.
• Liaise with suppliers to drive continuous improvement and verify new tooling, machines, and materials.
• Identify and develop new process technologies to meet business needs.
• Benchmark industry best practices for competitive advantage.
• Provide technical guidance and mentorship to engineers and project teams.
• Serve as primary technical expert for package singulation technology.

Skills

Semiconductor backend

Package singulation

Laser singulation

Blade dicing

Yield improvement

Problem solving

Stakeholder mgmt

Strategic thinking

Job description

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Engineer Unit Process Development Singulations in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role Key responsibilities in your new role

• Perform process development activities, including process parameter scouting, optimization, verification, and process freeze, to meet project targets in timeline, quality, cost competitiveness, and manufacturability.
• Drive qualification and implementation of: Tape-based singulation processes Tapeless singulation solutions Laser singulation technologies Hybrid singulation approaches
• Generate and maintain relevant documentation, including Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.
• Support prototype and development sample builds.
• Evaluate emerging singulation technologies and establish technology readiness for industrial deployment.
• Provide input and ensure accuracy of related documents, including Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance Checklist, and Unit Process Roadmap for development projects.
• Liaise with suppliers to drive continuous improvement and perform verification and qualification activities for new tooling, machines, and materials in development projects.
• Identify and develop new process technologies and improve process capability to meet business requirements.
• Benchmark industry best practices and identify opportunities for competitive advantage.
• Provide technical guidance and mentorship to engineers and project teams.
• Serve as the primary technical expert for package singulation technology, driving the development of high-performance, cost-effective, and scalable semiconductor package manufacturing solutions.

Qualifications and skills to help you succeed

• Minimum 10 years of experience in semiconductor backend assembly and package development.
• Minimum 5 years of direct experience in package singulation process development.
• Tape-based singulation
• Tapeless singulation
• Laser singulation
• Experience supporting high-volume semiconductor manufacturing environments.
• Demonstrated track record in process development, industrialization, and yield improvement.
• Blade dicing and saw singulation
• Tape-based package singulation
• Tapeless package handling and singulation
• UV and IR laser singulation processes
• Stealth and advanced laser dicing technologies
• Multi-package and panel-level singulation strategies
• Experience working with major singulation equipment suppliers and laser technology providers is an added advantage.
• Strong technical leadership and ability to influence without direct authority.
• Strategic thinking and technology roadmap planning capabilities.
• Excellent problem-solving and analytical skills.
• Strong stakeholder management and communication skills.

#WeAreIn for driving decarbonization and digitalization

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT.

Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.

Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion.

We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.