Senior Process Engineer / Process Engineer

Sanmina; Seberang Perai; On-site; MYR 100,000 - 150,000; Full time

Job summary

Jora Malaysia is seeking an independent Senior/Principal Process Engineer to lead SMT and SOM package development. You will drive NPI builds, DOE execution, and process development for advanced PCBA assemblies, aiming for excellent yield, quality, and reliability.

Strong SMT knowledge and hands-on Shadow Moiré analysis experience for warpage assessment are essential. You will collaborate withDesign and Quality teams to ensure process readiness and documentation compliance.

Qualifications

• Bachelor’s degree required in electronics/manufacturing/mechanical engineering or equivalent.

Responsibilities

• Lead SMT process development, optimization, and qualification for SOM and complex PCBA assemblies.
• Plan, execute, and interpret DOE to establish robust process windows.
• Drive NPI builds from prototype to mass production with documentation compliance.
• Define and control critical parameters like stencil design, paste selection, and reflow profile.
• Perform Shadow Moiré testing to assess warpage and impact on yield.
• Coordinate with design, material, and quality teams to troubleshoot and improve processes.
• Conduct DFM/DFT reviews and co-planarity control for advanced packaging.
• Maintain PFMEA, Control Plan, Process Flow, and Work Instructions.
• Evaluate materials and solder pastes per IPC/JEDEC standards.
• Ensure tasks are completed independently and on schedule.

Skills

SMT knowledge

Shadow Moiré

DOE design

NPI engineering

DFM/DFT reviews

Process docs

IPC/JEDEC

Analytical skills

Cross-functional

Proactive work

Education

Bachelor’s Degree in Electronics, Manufacturing, or Mechanical Engineering

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Senior Process Engineer / Process Engineer

We are seeking a highly independent and responsible Senior or Principal Process Engineer to lead SMT and SOM (System-on-Module) package development activities.

The selected candidate will be directly responsible for NPI builds, DOE execution, and process development for advanced PCBA assemblies, ensuring excellent yield, quality, and reliability performance.

Strong SMT process knowledge and hands‑on experience in Shadow Moiré analysis for package warpage characterization are essential.

Job Summary

We are seeking a highly independent and responsible Senior or Principal Process Engineer to lead SMT and SOM (System-on-Module) package development activities.

The selected candidate will be directly responsible for NPI builds, DOE execution, and process development for advanced PCBA assemblies, ensuring excellent yield, quality, and reliability performance.

Strong SMT process knowledge and hands‑on experience in Shadow Moiré analysis for package warpage characterization are essential.

Key Responsibilities

• Lead SMT process development, optimization, and qualification for SOM and complex PCBA assemblies.

• Plan, execute, and interpret Design of Experiments (DOE) to establish robust process windows.

• Drive NPI builds from prototype to mass production, ensuring full process readiness and documentation compliance.

• Define, verify, and control critical process parameters such as stencil design, paste selection, and reflow profile optimization.

• Perform and analyze Shadow Moiré testing to assess package warpage and thermal deformation impact on assembly yield.

• Coordinate with design, material, and quality teams to troubleshoot and implement process improvements.

• Conduct DFM/DFT reviews, void reduction trials, and co-planarity control for advanced packaging.

• Maintain accurate PFMEA, Control Plan, Process Flow, and Work Instruction documentation.

• Evaluate and qualify materials, solder pastes, fluxes, and SMT equipment in accordance with IPC/JEDEC standards.

• Ensure all assigned activities are completed independently, responsibly, and within project timelines.

Requirements

• Bachelor’s Degree in Electronics, Manufacturing, or Mechanical Engineering (or equivalent).

• Minimum 2 years hands‑on experience in SMT / PCBA / SOM process development or NPI engineering.

• In-depth knowledge of SMT process fundamentals: reflow profiling, stencil design, solder paste rheology, and AOI/SPC control.

• Experience in Shadow Moiré warpage analysis and interpreting thermal co-planarity results.

• Skilled in DOE, SPC, CPK, and structured problem‑solving methodologies (DMAIC, 5-Why, Fishbone).

• Familiar with IPC-A-610, J-STD-001, and JEDEC standards.

• Excellent analytical, documentation, and communication skills.

• Independent, proactive, and responsible in executing engineering tasks with minimal supervision.