NPI Engineer

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 78,000 - 123,000

Full time

4 days ago

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Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family

Car subsidy

Job summary

Carsem (M) Sdn. Bhd. in Ipoh, Malaysia is seeking an NPI Executive to lead technology development, manufacturing transfer, and NPI projects from FOL through EOL.

You will act as the primary technical and project interface among customers, suppliers, and internal teams to ensure mass production releases on time, within budget and to quality standards. The role requires a Bachelor’s/Diploma in engineering and 3+ years in semiconductor NPI or project management, with certified PMP or Lean Six Sigma

Qualifications

Bachelor’s/Diploma in Engineering (Mechanical, Electrical, Electronics, Materials, Manufacturing)
3+ years in project management or NPI in semiconductor manufacturing/assembly
PM or Lean Six Sigma certifications are strong advantages
Experience with semiconductor packaging (Leadframe/Substrate, QFN, DFN, BGA, LGA, SiP) and related processes
Experience in project scheduling, budget/CAPEX, risk mitigation, and change control
Solid understanding of Lean, Six Sigma, 8D, Automotive Semiconductor Qualification processes

Responsibilities

Lead NPI projects from kick-off to mass production release
Develop and maintain detailed project schedules and milestones
Coordinate with customers, suppliers, and internal teams for materials, tooling, and readiness
Lead customer tech reviews and manage ECR/ECO processes
Monitor performance against timelines, budgets, and quality
Ensure process readiness and lifecycle management from feasibility to ramp-up

Skills

Project management

NPI execution

Cross-functional leadership

Process readiness

Customer interface

Risk management

Quality improvement

Education

Bachelor's/Diploma in Engineering

PM/Lean Six Sigma certification (advantage)

Tools

PMP

Lean Six Sigma

Job description

To support our rapid business growth and increasing customer project demand, we are seeking a dynamic New Product Introduction (NPI) Executive to lead NPI, technology development, and manufacturing transfer projects across our semiconductor assembly operations—from Front-End of Line (FOL) through to End-of-Line (EOL).

In this role, you will serve as the primary technical and project management interface between customers, suppliers, manufacturing, and internal cross-functional teams. You will drive project execution excellence, process readiness, and customer satisfaction to ensure successful mass production releases within schedule, budget, and quality requirements.

Key Responsibilities

1. Project Management & NPI Execution

End-to-End Leadership: Lead cross-functional NPI projects from initial project kick-off all the way through to mass production release.

Project Planning: Develop and maintain detailed project schedules, milestone plans, risk registers, and robust contingency plans.

Performance Monitoring: Track and report project performance against timelines, cost budgets, quality standards, and customer milestones.

Lifecycle Management: Manage NPI activities from initial feasibility assessments through qualification, engineering builds, process characterization, and production ramp.

Primary Interface: Act as the main technical and project interface for customers throughout the entire project lifecycle.

Reviews & Changes: Lead customer technical reviews, deliver executive business updates, and manage Engineering Change Requests/Orders (ECR/ECO).

Collaboration: Coordinate with suppliers regarding materials, tooling, equipment, and process readiness, while aligning internal teams to achieve project goals.

3. Technical Coordination & Process Tracking

Process Oversight: Coordinate and monitor full-cycle semiconductor assembly processes, including:

Flip Chip / Cu Pillar Assembly and Wire Bonding.

Molding/Compression Molding, Singulation/Tape Saw, and Trim & Form.

Marking, Reliability Qualification, and Packaging/Shipment Readiness.

Advanced Evaluation: Support package development, DFM/DFX reviews, and evaluate new assembly technologies, materials, tooling, and equipment platforms.

4. Problem Solving & Quality Compliance

Structured Troubleshooting: Lead structured problem-solving and failure analysis activities using 8D, DMAIC, and Root Cause Analysis (RCA) methodologies.

Risk Mitigation: Identify technical, operational, and supply chain risks early; develop proactive mitigation plans and drive critical issues to closure.

Standards & Audits: Ensure absolute compliance with ISO 9001, IATF 16949, customer specifications, and internal quality standards while supporting audits.

Requirements & Qualifications

Education & Experience

Academic Background: Bachelor’s Degree or Diploma in Engineering (Mechanical, Electrical, Electronics, Materials, Manufacturing, or an equivalent technical field).

Industry Experience: Proven track record in project management or NPI engineering within a semiconductor manufacturing or assembly environment.

Valued Certifications: Project Management (PMP) or Lean Six Sigma certifications are considered strong advantages.

Semiconductor Packaging: Familiarity with Leadframe/Substrate packaging (QFN, DFN, BGA, LGA, SiP), MEMS, Silicon Photonics, Flip Chip, Cu Pillar, Wire Bonding, and Encapsulation.

Project & Change Management: Strong skills in project scheduling, Budget/CAPEX management, risk mitigation, and change control.

Quality Methodologies: Solid understanding of Lean Manufacturing, Six Sigma, 8D, and Automotive Semiconductor Qualification processes.

Requirements:
Experience: Preferably with 3 years of hands‑on experience in semiconductor assembly/packaging, specifically focusing on NPI or Project Management
Fresh graduates are encouraged to apply as well.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).