Senior Process Engineer

Lumentum; Seberang Perai; On-site; MYR 120,000 - 180,000; Full time

Job summary

Lumentum in Penang, Malaysia, seeks a Senior / Principal Process Engineer – Die Bond to lead high‑precision die bond and die attach processes, including laser die‑to‑submount assembly, and to partner with R&D, Quality, Operations and CM teams.

This role covers process development, transfer to manufacturing, qualification, yield improvement, and manufacturing readiness for high‑volume production, with hands‑on troubleshooting and mentoring of junior engineers.

Qualifications

• Bachelor’s degree or higher in a technical field.
• 8+ years in process/manufacturing engineering (senior) or 10+ years with leadership (principal).
• Experience with optoelectronic devices or precision assembly.
• NPI, process development, qualification, transfer to high-volume manufacturing.
• Hands-on die bond/die attach experience; laser die-to-submount preferred.
• Strong SPC, Cp/Cpk, DOE, stats and problem solving.
• Experience with contract manufacturers and cross-functional teams.
• Good English communication; willingness to travel internationally.

Responsibilities

• Develop, characterize, optimize, qualify, and sustain die bond/die attach processes.
• Own process parameters: placement/alignment, bonding force/temperature/time, bond-line thickness, materials, tooling, collet.
• Define process windows, control methods, acceptance criteria and capability requirements.
• Transfer new products from R&D into CM, ensure process readiness and ramp.
• Plan and execute First Article, CM qualification, process validation and readiness activities.
• Support product transitions from development to high-volume manufacturing.
• Maintain manufacturing docs: work instructions, specs, control plans.
• Lead yield improvements, root-cause investigations and corrective actions.
• Mentor junior engineers and lead cross-functional projects.
• Collaborate with R&D, Quality, Operations, Supply Chain, and suppliers.

Skills

Die bond

Process development

SPC

DOE

Problem solving

Cross-functional leadership

English communication

Travel internationally

Education

Bachelor's degree (engineering/related)

Tools

ASM

AMICRA

Silicool

Palomar

Job description

It's fun to work in a company where people truly BELIEVE in what they're doing! We are committed to bringing passion and customer focus to the business. If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Position Summary

We are seeking an experienced Senior / Principal Process Engineer – Die Bond to provide technical leadership and hands‑on engineering support for high‑precision optical and photonics manufacturing. This role will serve as a key technical owner for the die bond / die attach process, with responsibility for process development, characterization, qualification, technology transfer, manufacturing readiness, yield improvement, and high‑volume production ramp. The ideal candidate will have strong practical experience in high-precision die bonding, preferably involving laser die‑to‑submount assembly, and the ability to independently troubleshoot complex process and equipment issues on the manufacturing floor. The successful candidate will work closely with R&D, Quality, Operations, Supply Chain, equipment suppliers, and Contract Manufacturers to support successful product commercialization and sustained manufacturing excellence.

Key Responsibilities

Process Development and Technical Ownership

• Develop, characterize, optimize, qualify, and sustain high‑precision die bond and die attach processes.
• Own key process parameters, including placement and alignment accuracy, bonding force, bonding temperature and time, bond‑line thickness, material selection, tooling, and collet
• design.
• Define process windows, control methods, acceptance criteria, and capability requirements for critical process characteristics.
• Evaluate process, material, and equipment performance using engineering data and statistical analysis.
• Identify and implement new process concepts, equipment technologies, automation solutions, and manufacturing approaches.
• Provide technical leadership for complex die bond process and equipment challenges.

NPI and Manufacturing Transfer

• Transfer new products from R&D into Contract Manufacturing, ensuring process readiness and successful production ramp‑up.
• Support design‑for‑manufacturability activities and provide process feedback to R&D during early product development.
• Plan and execute engineering builds, First Article Inspection, process characterization, CM qualification, process validation, and manufacturing readiness activities.
• Support product transitions from development through qualification and high‑volume manufacturing.
• Provide technical support for products already transferred to manufacturing, including validation of process changes and second‑level engineering support for production issues.

Process Qualification and Documentation

• Develop and maintain manufacturing documentation, including work instructions, process specifications, control plans, process flow documentation, and engineering change records.
• Compile and evaluate test data to establish appropriate process limits, specifications, and material requirements.
• Ensure process changes are properly evaluated, qualified, documented, and implemented.
• Partner with Quality and Operations to ensure process controls are effectively maintained in production.

Yield Improvement and Problem Solving

• Analyze manufacturing data, SPC trends, yield performance, process capability, and defect data to identify improvement opportunities.
• Lead root‑cause investigations using structured problem‑solving methods, including 8D, 5‑Why, Fishbone, DOE, SPC, and fault‑tree analysis.
• Implement effective corrective and preventive actions and verify their effectiveness.
• Drive improvements in yield, process capability, product quality, reliability, cycle time, productivity, and manufacturing stability.
• Lead initiatives related to automation, cycle‑time reduction, equipment optimization, and cost reduction.

Cross‑Functional Leadership

• Lead cross‑functional projects involving new manufacturing technologies, equipment, automation, materials, and process improvements.
• Work closely with R&D, Quality, Operations, Supply Chain, equipment suppliers, and Contract Manufacturers to resolve technical issues and meet project milestones.
• Communicate technical risks, project status, recommendations, and recovery plans to internal and external stakeholders.
• Mentor junior engineers and provide technical guidance on complex manufacturing challenges.

Required Qualifications

• Bachelor’s degree or higher in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Mechatronics, Physics, Applied Physics, or a related technical field.
• Senior level: typically 8+ years of relevant experience in process or manufacturing engineering.
• Principal level: typically 10+ years of relevant experience with demonstrated technical leadership and ownership of complex manufacturing processes.
• Strong manufacturing engineering experience with optoelectronic devices, optical modules, or precision assembly.
• Strong experience with New Product Introduction, process development, product qualification, and transferring products into high‑volume manufacturing.
• Hands‑on experience developing, optimizing, and sustaining high‑precision die bond or die attach processes.
• Experience with laser die‑to‑submount assembly is strongly preferred.
• Strong knowledge of SPC, process capability analysis, Cp/Cpk, DOE, statistical data analysis, and structured problem solving.
• Experience working with Contract Manufacturers, equipment suppliers, and cross‑functional engineering teams.
• Good English communication skills, both written and verbal.
• Willingness and ability to travel internationally as required.

Preferred Experience

• Experience with optical communication products, optical transceivers, tunable lasers, optical receivers, photonic devices, or related optoelectronic assemblies.
• Experience with high‑precision die bond platforms such as ASM, AMICRA, Silicool, Palomar, or equivalent equipment.
• Experience with active alignment, passive alignment, laser attach, submount assembly, and precision optical packaging.
• Experience with process automation, equipment integration, tooling design, collet design, and manufacturing equipment qualification.
• Experience working with Contract Manufacturers in an international or multi‑site manufacturing environment.

Senior and Principal Level Expectations

Senior Process Engineer

• Independently owns die bond process development, qualification, transfer, and sustaining support.
• Leads technical problem solving and process‑improvement projects.
• Provides hands‑on support to manufacturing and Contract Manufacturer teams.
• Mentors junior engineers and supports cross‑functional project execution.

Principal Process Engineer

• Serves as the technical authority for die bond and die attach processes across products or manufacturing sites.
• Defines process technology direction, standards, and long‑term improvement roadmaps.
• Leads complex, high‑impact technology‑transfer, automation, yield, and manufacturing‑readiness programs.
• Influences product design and process strategy through strong DFM and technical leadership.
• Provides senior‑level guidance to engineering, operations, Contract Manufacturers, equipment suppliers, and leadership teams.

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Please contact us to request accommodation.