Senior Die Bond Engineer: Photonics Manufacturing Leader

Lumentum Operations LLC; Penang; On-site; MYR 180,000 - 320,000; Full time

Job summary

Lumentum Operations LLC seeks an experienced Senior/Principal Process Engineer – Die Bond to lead and optimize high-precision die bond and die attach processes for photonic manufacturing. You will own process windows, quality controls, and transfer to contract manufacturers, ensuring manufacturing readiness and scalable production.

The role requires hands-on expertise in laser die‑to‑submount assembly, strong data analysis, and collaboration across R&D, Quality, Operations, and Supply Chain to

Qualifications

• Bachelor-level engineering degree or higher in a technical field.
• Minimum 8 years (Senior) or 10+ years (Principal) in process/manufacturing engineering with leadership.
• Experience with optoelectronic devices or precision assembly preferred.
• Hands-on die bond/die attach process development and transfer to manufacturing.
• Experience with laser die‑to‑submount assembly is strongly preferred.
• Strong knowledge of SPC, Cp/Cpk, DOE and statistical data analysis.

Responsibilities

• Own and develop high-precision die bond and die attach processes from development through qualification.
• Lead NPI activities and manufacturing transfer to CM partners.
• Create and maintain process documentation, work instructions, and control plans.
• Lead root-cause analysis and implement corrective actions to improve yield and reliability.
• Collaborate with R&D, Quality, Operations, and suppliers to ensure manufacturing readiness.

Skills

Die bonding

SPC

Cp/Cpk

DOE

Statistical analysis

Root-cause analysis

Cross-functional leadership

Laser die-to-submount

Education

Bachelor's degree or higher in Mechanical Engineering

Materials Engineering

Manufacturing Engineering

Electronics Engineering

Mechatronics

Physics

Tools

ASM

AMICRA

Silicool

Palomar

Job description

Lumentum Operations LLC seeks an experienced Senior/Principal Process Engineer – Die Bond to lead and optimize high-precision die bond and die attach processes for photonic manufacturing. You will own process windows, quality controls, and transfer to contract manufacturers, ensuring manufacturing readiness and scalable production.

The role requires hands-on expertise in laser die‑to‑submount assembly, strong data analysis, and collaboration across R&D, Quality, Operations, and Supply Chain to