Senior Process Engineer

Lumentum Operations LLC

Penang

On-site

MYR 180,000 - 320,000

Full time

11 days ago
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Job summary

Lumentum Operations LLC seeks an experienced Senior/Principal Process Engineer – Die Bond to lead and optimize high-precision die bond and die attach processes for photonic manufacturing. You will own process windows, quality controls, and transfer to contract manufacturers, ensuring manufacturing readiness and scalable production.

The role requires hands-on expertise in laser die‑to‑submount assembly, strong data analysis, and collaboration across R&D, Quality, Operations, and Supply Chain to

Qualifications

  • Bachelor-level engineering degree or higher in a technical field.
  • Minimum 8 years (Senior) or 10+ years (Principal) in process/manufacturing engineering with leadership.
  • Experience with optoelectronic devices or precision assembly preferred.
  • Hands-on die bond/die attach process development and transfer to manufacturing.
  • Experience with laser die‑to‑submount assembly is strongly preferred.
  • Strong knowledge of SPC, Cp/Cpk, DOE and statistical data analysis.

Responsibilities

  • Own and develop high-precision die bond and die attach processes from development through qualification.
  • Lead NPI activities and manufacturing transfer to CM partners.
  • Create and maintain process documentation, work instructions, and control plans.
  • Lead root-cause analysis and implement corrective actions to improve yield and reliability.
  • Collaborate with R&D, Quality, Operations, and suppliers to ensure manufacturing readiness.

Skills

Die bonding
SPC
Cp/Cpk
DOE
Statistical analysis
Root-cause analysis
Cross-functional leadership
Laser die-to-submount

Education

Bachelor's degree or higher in Mechanical Engineering
Materials Engineering
Manufacturing Engineering
Electronics Engineering
Mechatronics
Physics

Tools

ASM
AMICRA
Silicool
Palomar

Job description

Position Summary

We are seeking an experienced Senior / Principal Process Engineer – Die Bond to provide technical leadership and hands‑on engineering support for high‑precision optical and photonics manufacturing. This role will serve as a key technical owner for the die bond / die attach process, with responsibility for process development, characterization, qualification, technology transfer, manufacturing readiness, yield improvement, and high‑volume production ramp. The ideal candidate will have strong practical experience in high‑precision die bonding, preferably involving laser die‑to‑submount assembly, and the ability to independently troubleshoot complex process and equipment issues on the manufacturing floor. The successful candidate will work closely with R&D, Quality, Operations, Supply Chain, equipment suppliers, and Contract Manufacturers to support successful product commercialization and sustained manufacturing excellence.

Key Responsibilities
  • Process Development and Technical Ownership Develop, characterize, optimize, qualify, and sustain high‑precision die bond and die attach processes. Own key process parameters, including placement and alignment accuracy, bonding force, bonding temperature and time, bond‑line thickness, material selection, tooling, and collet design. Define process windows, control methods, acceptance criteria, and capability requirements for critical process characteristics. Evaluate process, material, and equipment performance using engineering data and statistical analysis. Identify and implement new process concepts, equipment technologies, automation solutions, and manufacturing approaches. Provide technical leadership for complex die bond process and equipment challenges.
  • NPI and Manufacturing Transfer Transfer new products from R&D into Contract Manufacturing, ensuring process readiness and successful production ramp‑up. Support design‑for‑manufacturability activities and provide process feedback to R&D during early product development. Plan and execute engineering builds, First Article Inspection, process characterization, CM qualification, process validation, and manufacturing readiness activities. Support product transitions from development through qualification and high‑volume manufacturing. Provide technical support for products already transferred to manufacturing, including validation of process changes and second‑level engineering support for production issues.
  • Process Qualification and Documentation Develop and maintain manufacturing documentation, including work instructions, process specifications, control plans, process flow documentation, and engineering change records. Compile and evaluate test data to establish appropriate process limits, specifications, and material requirements. Ensure process changes are properly evaluated, qualified, documented, and implemented. Partner with Quality and Operations to ensure process controls are effectively maintained in production.
  • Yield Improvement and Problem Solving Analyze manufacturing data, SPC trends, yield performance, process capability, and defect data to identify improvement opportunities. Lead root‑cause investigations using structured problem‑solving methods, including 8D, 5‑Why, Fishbone, DOE, SPC, and fault‑tree analysis. Implement effective corrective and preventive actions and verify their effectiveness. Drive improvements in yield, process capability, product quality, reliability, cycle time, productivity, and manufacturing stability. Lead initiatives related to automation, cycle‑time reduction, equipment optimization, and cost reduction.
  • Cross‑Functional Leadership Lead cross‑functional projects involving new manufacturing technologies, equipment, automation, materials, and process improvements. Work closely with R&D, Quality, Operations, Supply Chain, equipment suppliers, and Contract Manufacturers to resolve technical issues and meet project milestones. Communicate technical risks, project status, recommendations, and recovery plans to internal and external stakeholders. Mentor junior engineers and provide technical guidance on complex manufacturing challenges.
Required Qualifications
  • Bachelor’s degree or higher in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Mechatronics, Physics, Applied Physics, or a related technical field.
  • Senior level: typically 8+ years of relevant experience in process or manufacturing engineering. Principal level: typically 10+ years of relevant experience with demonstrated technical leadership and ownership of complex manufacturing processes.
  • Strong manufacturing engineering experience with optoelectronic devices, optical modules, or precision assembly.
  • Strong experience with New Product Introduction, process development, product qualification, and transferring products into high‑volume manufacturing.
  • Hands‑on experience developing, optimizing, and sustaining high‑precision die bond or die attach processes.
  • Experience with laser die‑to‑submount assembly is strongly preferred.
  • Strong knowledge of SPC, process capability analysis, Cp/Cpk, DOE, statistical data analysis, and structured problem solving.
  • Experience working with Contract Manufacturers, equipment suppliers, and cross‑functional engineering teams.
  • Good English communication skills, both written and verbal.
  • Willingness and ability to travel internationally as required.
Preferred Experience
  • Experience with optical communication products, optical transceivers, tunable lasers, optical receivers, photonic devices, or related optoelectronic assemblies.
  • Experience with high‑precision die bond platforms such as ASM, AMICRA, Silicool, Palomar, or equivalent equipment.
  • Experience with active alignment, passive alignment, laser attach, submount assembly, and precision optical packaging.
  • Experience with process automation, equipment integration, tooling design, collet design, and manufacturing equipment qualification.
  • Experience working with Contract Manufacturers in an international or multi‑site manufacturing environment.
Senior and Principal Level Expectations
  • Senior Process Engineer Independently owns die bond process development, qualification, transfer, and sustaining support. Leads technical problem solving and process‑improvement projects. Provides hands‑on support to manufacturing and Contract Manufacturer teams. Mentors junior engineers and supports cross‑functional project execution.
  • Principal Process Engineer Serves as the technical authority for die bond and die attach processes across products or manufacturing sites. Defines process technology direction, standards, and long‑term improvement roadmaps. Leads complex, high‑impact technology‑transfer, automation, yield, and manufacturing‑readiness programs. Influences product design and process strategy through strong DFM and technical leadership. Provides senior‑level guidance to engineering, operations, Contract Manufacturers, equipment suppliers, and leadership teams.
Equal Opportunity Employer

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Company Description

Lumentum is illuminating the networks of tomorrow with advanced photonic technologies that enable AI, data centers, telecom, industrial, and sensing applications. As AI accelerates the global demand for bandwidth and energy efficiency, we deliver the building blocks that keep data moving reliably, efficiently, and at massive scale. Our optical products support AI and compute infrastructure, cloud and DCI environments, metro and long‑haul networks, while our lasers drive breakthroughs in precision manufacturing and sensing. For nearly five decades, Lumentum has been at the intersection of light and innovation. What began as a vision with JDS Uniphase to harness the power of photonics has evolved into a global force driving the communication infrastructure of tomorrow. At Lumentum, we’re building more than a business—we’re building a team of passionate innovators whose drive to collaborate, create, and connect the world fuels everything we do. We are part of the AI technology revolution and we are illuminating the path forward. Headquartered in San Jose, California, we operate worldwide through a network of R&D, manufacturing, and sales locations.

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