Senior Principal Engineer - Semiconductor Process Singulation

Infineon Technologies; Malacca City; On-site; MYR 250,000 - 400,000; Full time

Job summary

Infineon Technologies Malaysia is seeking a Principal Engineer in Unit Process Singulation to shape advanced semiconductor packaging solutions. You will lead development of tape- and laser-based singulation, drive qualification, mentor engineers and collaborate with suppliers across sites.

The role requires strong technical leadership, extensive experience in packaging and singulation technologies, and a strategic mindset to advance process roadmaps and IP generation in a global environment.

Qualifications

• Masters or Bachelor’s Degree in Engineering or related field.
• 12+ years in semiconductor backend assembly and package development.
• 7+ years in package singulation and laser marking process development.

Responsibilities

• Perform process development activities to meet targets in timeline, quality, cost and manufacturability.
• Drive qualification and implementation of tape-based and tapeless singulation, laser marking and related technologies.
• Lead or support knowledge transfer to Operations and document key process specs and risk analyses.
• Collaborate with suppliers to drive tooling, equipment and material verification and qualification.

Skills

Process development

Tape-based singulation

Laser marking

Team leadership

Problem solving

Stakeholder management

Technical mentorship

Education

Master’s or Bachelor’s Degree in Engineering

Tools

Tape-based equipment

Laser equipment

DFMEA/PFMEA

Job description

Infineon Technologies Malaysia is seeking a Principal Engineer in Unit Process Singulation to shape advanced semiconductor packaging solutions. You will lead development of tape- and laser-based singulation, drive qualification, mentor engineers and collaborate with suppliers across sites.

The role requires strong technical leadership, extensive experience in packaging and singulation technologies, and a strategic mindset to advance process roadmaps and IP generation in a global environment.