Principal Engineer Unit Process Singulation

Infineon Technologies; Malacca City; On-site; MYR 250,000 - 400,000; Full time

Job summary

Infineon Technologies Malaysia is seeking a Principal Engineer in Unit Process Singulation to shape advanced semiconductor packaging solutions. You will lead development of tape- and laser-based singulation, drive qualification, mentor engineers and collaborate with suppliers across sites.

The role requires strong technical leadership, extensive experience in packaging and singulation technologies, and a strategic mindset to advance process roadmaps and IP generation in a global environment.

Qualifications

• Masters or Bachelor’s Degree in Engineering or related field.
• 12+ years in semiconductor backend assembly and package development.
• 7+ years in package singulation and laser marking process development.

Responsibilities

• Perform process development activities to meet targets in timeline, quality, cost and manufacturability.
• Drive qualification and implementation of tape-based and tapeless singulation, laser marking and related technologies.
• Lead or support knowledge transfer to Operations and document key process specs and risk analyses.
• Collaborate with suppliers to drive tooling, equipment and material verification and qualification.

Skills

Process development

Tape-based singulation

Laser marking

Team leadership

Problem solving

Stakeholder management

Technical mentorship

Education

Master’s or Bachelor’s Degree in Engineering

Tools

Tape-based equipment

Laser equipment

DFMEA/PFMEA

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Principal Engineer Unit Process Singulation

Responsibility #WeAreIn for jobs that impact everyone's life.

Build the future nobody’s dreamed of yet...are you ready to rethink the impossible?

As a Principal Engineer Unit Process Singulation in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your Role

Key responsibilities in your new role

• Perform process development activities, including process parameter scouting, optimization, verification, and Process Freeze, within development projects to achieve targets in timeline, quality, cost competitiveness, and manufacturability.
• Drive the qualification and implementation of tape-based singulation processes, tapeless singulation solutions, laser marking and singulation technologies, and hybrid singulation approaches.
• Lead or support technical handover and knowledge transfer activities to Operations.
• Generate, maintain, and update relevant technical documentation, including Process Specifications, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.
• Support the build and evaluation of prototypes and development samples.
• Evaluate emerging singulation technologies and establish technology readiness for industrial deployment.
• Provide input for the creation and maintenance of related documentation and ensure content accuracy, including Process of Record, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, Maintenance Checklists, and Unit Process Roadmaps for development projects.
• Collaborate with suppliers to drive continuous improvement initiatives and perform verification and qualification activities for new tooling, equipment, and materials within development projects.
• Identify and develop new process technologies while enhancing process capability to meet evolving business requirements.
• Benchmark industry best practices and identify opportunities to strengthen competitive advantages.
• Provide technical guidance and mentorship to engineers and project team members.
• Initiate, develop, and drive intellectual property (IP) ideas through research and technology exploration.
• Stay abreast of emerging technologies to define and drive the direction of process technologies, materials, equipment, and tooling solutions.
• Serve as the Area of Knowledge (AoK) consultant across sites and globally within Infineon, acting as a multiplier within the Technical Ladder (TL) community.
• Lead technical critical path activities for development projects and AoK‑related initiatives across sites.
• Act as the primary technical expert in package singulation technology, driving the development of next‑generation, high‑performance, cost‑effective, and scalable semiconductor packaging solutions.

Your profile

Qualifications And Skills To Help You Succeed

• Master’s or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 12 years of experience in semiconductor backend assembly and package development.
• Minimum 7 years of direct experience in package singulation and laser marking process development.
• Proven hands‑on expertise in tape‑based singulation, tapeless singulation, laser marking and singulation.
• Experience supporting high‑volume semiconductor manufacturing environments.
• Demonstrated track record in process development, industrialization, and yield improvement.
• Technical expertise in various singulation technologies, including blade dicing and saw singulation, tape‑based package singulation, tapeless package handling and singulation, UV and IR laser processes, stealth and advanced laser dicing technologies, and multi‑package and panel‑level singulation strategies.
• Experience working with major singulation equipment suppliers and laser technology providers is an added advantage.
• Strong technical leadership skills with the ability to influence without direct authority.
• Strategic thinking capability with experience in technology roadmap planning.
• Excellent analytical and problem­solving skills.
• Strong stakeholder management, communication, and interpersonal skills.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.