Senior Power Packaging Leadframe & Substrate Designer

Carsem

Ipoh

On-site

MYR 120,000 - 190,000

Full time

7 days ago

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Job summary

Carsem in Ipoh, Malaysia seeks a seasoned Leadframe & Substrate Design Engineer to lead design, simulation, and rules development for advanced semiconductor packaging. You will drive sub-micron precision packaging in power discrete segment beyond QFNs into power modules, bridging CAD modeling, multiphysics simulations, DFM/DFT, and customer-facing technical support.

Ideal candidates have 7+ years in leadframe/substrate design, expertise in CAD/FEA tools, GD&T, and strong cross-functional

Qualifications

7+ years hands-on Leadframe & Substrate design in Power Discrete domains.
Expert in GD&T, DFM/DFT, and thermal/electrical modeling.
Strong CAD/FEA tooling proficiency and customer-facing reviews.

Responsibilities

Lead 3D mechanical modeling and simulation of leadframes and substrates.
Apply GD&T to ensure sub-micron precision for critical components.
Perform TMA and electrical parasitic modeling to evaluate high-power performance.
Conduct robust FEA simulations to mitigate design risks.
Establish and update internal design rules; drive DFM/DFT practices.
Collaborate with Assembly, Mechanical, QA, and tooling vendors; engage customers.
Ensure designs meet cost, thermal, electrical performance, and regulatory standards.