Staff Engineer, Packaging Engineering (FIB)

Sandisk; Batu Kawan; On-site; MYR 90,000 - 130,000; Full time

Job summary

Sandisk seeks an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. The role integrates with CPI Failure Analysis and collaborates with wafer fabrication, package design, assembly R&D, and characterization teams.

The position focuses on improving device reliability, leading package evaluation for NAND/ASIC, and informing design decisions through detailed failure analysis.

Qualifications

• 3+ years hands-on SEM and FIB experience.
• Strong understanding of device structures, packaging architectures, and failure mechanisms.
• Ability to work effectively in cross‑functional, global teams.

Responsibilities

• Develop and maintain package recipe and process baselines based on FA findings.
• Collaborate with fab process, package design, assembly R&D, and characterization teams.
• Evaluate package reliability and robustness in response to fab process changes.
• Lead package evaluation and qualification for NAND and ASIC technologies.
• Support chip structure optimization through detailed FA results and recommendations.
• Provide FA insights to influence package and product design decisions.

Skills

SEM

FIB

PFA

Education

Bachelor’s degree in Materials Science or related field

Tools

SEM

FIB

Job description

We are seeking an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. This role is part of the Chip Package Integration (CPI) Failure Analysis function and plays a key role in improving device reliability and influencing package and product design. The position interfaces closely with wafer fabrication (NAND and ASIC), package and product design teams, electrical and physical characterization, assembly R&D, and other process engineering groups.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Develop and maintain package recipe and process baselines based on FA findings.
• Collaborate with fab process, package design, assembly R&D, and characterization teams.
• Evaluate package reliability and robustness in response to fab process changes.
• Lead package evaluation and qualification for NAND and ASIC technologies.
• Support chip structure optimization through detailed FA results and recommendations.
• Perform device-level physical failure analysis (PFA) using SEM and FIB techniques (mandatory).
• Conduct FIB cross-sectioning, delayering, and defect localization for root-cause analysis.
• Utilize SEM imaging to analyze device structures, interfaces, and failure mechanisms.
• Identify and resolve structural and packaging-related reliability issues.
• Provide FA insights to influence package and product design decisions.

REQUIRED

• Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines.
• Strong understanding of device structures, packaging architectures, and failure mechanisms.
• More than 3 years hands-on SEM and FIB experience (MUST).
• Solid experience in physical failure analysis (PFA) of semiconductor devices.
• Good English communication skills, both written and spoken.
• Ability to work effectively in cross‑functional, global teams.

PREFERRED

• Background in wafer fab processes and device design.
• Experience with NAND and/or ASIC technologies.
• Familiarity with electrical and physical characterization methods.
• Knowledge of assembly processes and advanced semiconductor packaging.
• Experience supporting fab or package process change qualification.

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