Lead Failure Analysis Engineer – IC & Wafer Expert

Infineon Technologies AG

Kulim

On-site

MYR 66,960 - 133,920

Full time

14 days+

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Job summary

Infineon Technologies AG in Kulim, Malaysia is seeking a highly skilled Electrical/Electronic Engineering professional to support FA activities for ICs and packages. You will provide technical guidance to FA personnel, perform advanced electrical failure verification, localization, and imaging to identify root causes, and prepare reports for cross-functional review.

The role requires expertise in IV curves, OBIRCH/TIVA/SEI localization, high-level sample preparation, and CAD navigation.

Qualifications

Advanced electrical failure verification and localization including bench testing for IV curve and functional verification.
Imaging for defect visualization: optical, SEM and FIB (Voltage Contrast).
Advanced sample preparation: wet/dry chemical, backside, packaging prep.

Responsibilities

Provide technical guidance in multiple Fields of Knowledge to FA personnel pertaining to EFA.
Perform up to complex level of IC FA including electrical verification and fault isolation on package and wafer samples.
Complex localization of parametric and functional failure (bench verification + EFL technique).
Lead CAD navigation, layout and schematic analysis to identify failure location and hypothesis.
Lead sample preparation and microscopy inspection for clear visualization of defects at package and wafer level.
Prepare FA reports that lead to root-cause findings and drive corrective action; lead FA discussions in cross-functional meetings.
Drive FA interfacing with test, product, process integration and unit process engineers for effective analysis support.
Identify development opportunities of new EFA techniques and improve FA skills to enhance quality, speed, and cost.
Drive FA for achieving EFA KPIs.