Senior PFA Packaging Engineer (SEM/FIB)

Sandisk; Batu Kawan; On-site; MYR 90,000 - 130,000; Full time

Job summary

Sandisk seeks an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. The role integrates with CPI Failure Analysis and collaborates with wafer fabrication, package design, assembly R&D, and characterization teams.

The position focuses on improving device reliability, leading package evaluation for NAND/ASIC, and informing design decisions through detailed failure analysis.

Qualifications

• 3+ years hands-on SEM and FIB experience.
• Strong understanding of device structures, packaging architectures, and failure mechanisms.
• Ability to work effectively in cross‑functional, global teams.

Responsibilities

• Develop and maintain package recipe and process baselines based on FA findings.
• Collaborate with fab process, package design, assembly R&D, and characterization teams.
• Evaluate package reliability and robustness in response to fab process changes.
• Lead package evaluation and qualification for NAND and ASIC technologies.
• Support chip structure optimization through detailed FA results and recommendations.
• Provide FA insights to influence package and product design decisions.

Skills

SEM

FIB

PFA

Education

Bachelor’s degree in Materials Science or related field

Tools

SEM

FIB

Job description

Sandisk seeks an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. The role integrates with CPI Failure Analysis and collaborates with wafer fabrication, package design, assembly R&D, and characterization teams.

The position focuses on improving device reliability, leading package evaluation for NAND/ASIC, and informing design decisions through detailed failure analysis.