Engineer, Packaging Engineering (Mechanical Design)

Sandisk; Kampung Sekolah Simpang Ampat; On-site; MYR 90,000 - 120,000; Full time

Job summary

Sandisk Malaysia is seeking a Packaging Engineer (Mechanical Design) to lead thermal design initiatives for semiconductor packaging at PCBA and host levels. You will perform CFD-based thermal modeling and validate Flash product PCBA using analytical and measurement methods.

The role focuses on delivering reliable thermal solutions for increasingly small form factors in constrained environments, collaborating with suppliers and manufacturing teams to release packages on schedule.

Qualifications

• Bachelor's degree in Mechanical Engineering with 5+ years of related industry experience.
• Solid knowledge of mechanical design from coursework or experience.
• Proficiency in CAD software: SolidWorks, AutoCAD.
• Understanding of drafting standards and tolerance analysis.
• Background in mechanical design with electronics product design is a plus.
• Knowledge of plastic injection molding and metal fabrication.
• Ability to work in a team and meet release schedules.

Responsibilities

• Work in Packaging R&D on thermal designs across packaging levels.
• Perform thermal modeling (CFD) and validate PCBA for flash products.
• Address small form factor packages in constrained thermal environments.

Skills

Strong communication

Team player

Work ethic

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

AutoCAD

Plastic injection molding

Metal fabrication

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Engineer, Packaging Engineering (Mechanical Design)

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Qualifications

REQUIRED:

• B.S.in Mechanical Engineering plus 5years,of relevant industry experience
• Solid knowledge through academic coursework or experience required in Mechanical design
• Proficiency in CAD software (e.g. SolidWorks, Autocad)
• Knowledge of engineering drafting standards and tolerance analysis
• A strong background in mechanical designwith electronic consumer product design a plus
• Knowledge of plastic injection molding and metal fabrication
• Demonstrated strong work ethic
• Prior history workingwith outside suppliers and contract manufacturers
• Ability to work in a team environment and interact with others to release products on schedule

SKILLS:

• Strong oral and written communication skills.
• Demonstrated strong work ethic.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at[[e-mail]]to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.