Materials Engineer (Packaging)

NCS Solutions; Bayan Lepas; On-site; MYR 78,000 - 134,000; Full time

Benefits offered by this job

Annual Leave

Medical and Hospitalisation Leave

EPF

SOCSO

EIS

Annual Bonus

Training Provided

Job summary

Jora Malaysia is seeking an analytical specialist in Penang to perform electrical validation, defect analysis, and root cause determination on failed products. The role requires a Bachelor's degree in Material Science, Physics, Mechanical, or Chemical Engineering, and hands-on experience with analytical instruments listed above.

The candidate will interpret results, prepare reports, and help prevent recurrence by proposing corrective actions.

Qualifications

• Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
• Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
• Strong analytical thinking and problem-solving skills.
• Familiarity with material analysis techniques such as FTIR, XPS, and ToF-SIMS is an advantage.

Responsibilities

• Perform electrical validation and fault isolation on failed products.
• Identify and analyze physical defects related to electrical failures.
• Evaluate assembly, fabrication, and substrate processes to determine root causes of failure.
• Assess material properties and mechanical characteristics of components for defect analysis.
• Use analytical tools such as Parametric Analyzer (I/V analysis), Keithley Meter, TDR, EOTPR; SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IRLC.
• Interpret results to understand failure modes and mechanisms.
• Prepare and publish analytical reports with root cause findings and corrective action recommendations.
• Review failure reports and propose actions to prevent recurrence.
• Develop analytical methods and metrology solutions for new package technologies.
• Support new package transfers and share best-known methods with Assembly Test Manufacturing (ATM) sites.

Skills

Analytical thinking

Education

Bachelor’s degree in Material Science, Physics, Mechanical or Chemical Engineering

Tools

Parametric Analyzer

Keithley Meter

TDR

EOTPR

SEM/EDX

FTIR

X-Ray

ToF-SIMS

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.

Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.

Strong analytical thinking and problem-solving skills.

Familiarity with material analysis techniques such asFTIR, XPS, and ToF-SIMS is an advantage.

Requirement

• Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.

• Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.

• Strong analytical thinking and problem-solving skills.

• Familiarity with material analysis techniques such asFTIR, XPS, and ToF-SIMS is an advantage.

Responsibility

• Perform electrical validation and fault isolation on failed products.

• Identify and analyze physical defects related to electrical failures.

• Evaluate assembly, fabrication, and substrate processes to determine root causes of failure.

• Assess material properties and mechanical characteristics of components for defect analysis.

• Use analytical tools such as

  • Parametric Analyzer (I/V analysis), Keithley Meter, TDR, EOTPR

  • SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IRLC

  • Mechanical & chemical sample preparation

• Interpret results to understand failure modes and mechanisms.

• Prepare and publish analytical reports with root cause findings and corrective action recommendations.

• Review failure reports and propose actions to prevent recurrence.

• Develop analytical methods and metrology solutions for new package technologies.

• Support new package transfers and share best-known methods with Assembly Test Manufacturing (ATM) sites.

Benefits

• Annual Leave
• Medical and Hospitalisation Leave
• EPF
• SOCSO
• EIS
• Annual Bonus
• Training Provided