Senior Mechanical Engineer, Electronics Packaging & R&D

Copeland; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Emerson NI in the Test & Measurement (T&M) Business Unit seeks a Senior Mechanical Engineer to join the R&D team. You will lead the design of electronics packaging from concept to production, ensuring the mechanical architecture meets product requirements and is manufacturable.

You will collaborate with global teams to perform tolerances, thermal and structural analyses, plan mechanical testing, and guide suppliers and manufacturing to achieve high yield and quality.

Qualifications

• Bachelor's or Master's in Mechanical Engineering or related field
• Minimum 5 years of mechanical design and product development experience
• Experience with electronics hardware or industrial products; knowledge of tolerances, materials and manufacturing processes

Responsibilities

• Lead the design and development of electronics packaging from concept to production
• Define the mechanical architecture and select materials, components, and hardware to meet product requirements
• Perform tolerance, thermal, and structural analyses to identify risks and ensure product reliability
• Plan and conduct mechanical testing, analyze results, and improve the design
• Develop specifications for mechanical materials and manufacturing processes
• Qualify and support suppliers to meet manufacturing and quality requirements
• Support manufacturing to resolve issues, improve yield, and maintain product quality
• Work with procurement and suppliers to ensure quality and on‑time delivery of mechanical parts
• Provide technical guidance, mentor engineers, and improve mechanical design practices

Skills

Mechanical design

Thermal analysis

Structural analysis

Cross-functional collaboration

English communication

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Creo

SolidWorks

Job description

Emerson NI in the Test & Measurement (T&M) Business Unit seeks a Senior Mechanical Engineer to join the R&D team. You will lead the design of electronics packaging from concept to production, ensuring the mechanical architecture meets product requirements and is manufacturable.

You will collaborate with global teams to perform tolerances, thermal and structural analyses, plan mechanical testing, and guide suppliers and manufacturing to achieve high yield and quality.