Senior Maintenance Engineer - Semiconductors

Versatile Creation Sdn Bhd

Kulim

On-site

MYR 120,000 - 180,000

Full time

7 days ago
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Job summary

Versatile Creation Sdn Bhd in Malaysia seeks a Maintenance Engineer to ensure high equipment availability and minimize downtime across semiconductor processes. You will perform troubleshooting, preventive maintenance, and drive improvements to reliability and productivity.

The role requires a Bachelor’s degree in Engineering and at least 4 years in IC Substrate/HDI-PCB/IC packaging or related fields, with strong analytical and leadership skills. Weekend/on-call duties may apply.

Qualifications

  • Bachelor’s degree in engineering or related field.
  • 4+ years in equipment maintenance or process engineering in semiconductor industries.
  • Experience with preventive maintenance and reliability.
  • Knowledge of SPC, MSA, DOE, FMEA, CP.
  • Ability to lead and train maintenance teams.
  • Willing to work weekends/holidays as per duty roster.

Responsibilities

  • Ensure high equipment availability and minimize production downtime.
  • Perform equipment troubleshooting, repair, and PM.
  • Monitor PM effectiveness and improve reliability.
  • Manage critical spares and coordinate with suppliers/purchasing.
  • Drive continuous improvement to enhance equipment performance.
  • Support new equipment installation, hookup, qualification, and readiness.
  • Coordinate with cross-functional teams for setup and release.
  • Identify operational risks and implement mitigations.
  • Provide technical guidance and training to maintenance team.

Education

Bachelor’s Degree in Engineering or related field

Tools

SPC
MSA
DOE
FMEA
Control Plan (CP)

Job description

Versatile Creation Sdn Bhd in Malaysia seeks a Maintenance Engineer to ensure high equipment availability and minimize downtime across semiconductor processes. You will perform troubleshooting, preventive maintenance, and drive improvements to reliability and productivity.

The role requires a Bachelor’s degree in Engineering and at least 4 years in IC Substrate/HDI-PCB/IC packaging or related fields, with strong analytical and leadership skills. Weekend/on-call duties may apply.

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