Senior Field Service Engineer - Semiconductor Equipment

Nexperia Germany; Shah Alam; On-site; MYR 90,000 - 140,000; Full time

Job summary

Nexperia is seeking a results-driven engineer to lead on-site installation, commissioning, and ongoing support for high-precision semiconductor equipment in Malaysia. You will collaborate with customers to ensure performance targets, lead beta tests, and assist product development based on feedback.

The role demands strong problem-solving, travel readiness, and fluency in English, with experience in die-bond equipment considered an asset.

Qualifications

• Bachelor-level degree in Mechanical, Electrical or Mechatronics Engineering.
• Minimum 5 years of experience in semiconductor/electronics manufacturing.
• Experience with high-precision assembly equipment.
• Analytical mindset with strong problem-solving and organizational skills.
• Willing to travel frequently.
• Fluent in English and good interpersonal communication.

Responsibilities

• Install, set up and buy off new machines/modules at customer sites.
• Support assembly sites in troubleshooting after machine release.
• Provide product development input based on customer feedback.
• Prototype building and testing of equipment or improvements.
• Validate products against customer design requirements.
• Lead Beta-tests at customer sites and resolve technical issues.
• Improve machine quality, speed and cost performance.
• Train customers and accept new equipment.
• Facilitate regular technical meetings with customers.
• Experience with Die-bond equipment is advantageous.

Skills

Problem solving

Analytical mindset

Teamwork

Communication in English

Travel readiness

Education

Degree in Mechanical, Electrical or Mechatronics Engineering

Tools

Die-bond equipment

Job description

Nexperia is seeking a results-driven engineer to lead on-site installation, commissioning, and ongoing support for high-precision semiconductor equipment in Malaysia. You will collaborate with customers to ensure performance targets, lead beta tests, and assist product development based on feedback.

The role demands strong problem-solving, travel readiness, and fluency in English, with experience in die-bond equipment considered an asset.