Senior Staff Engineer Die Attach Process Innovation

Infineon Technologies AG; Malacca City; On-site; MYR 120,000 - 240,000; Full time

Job summary

Infineon Technologies AG in Malaysia invites a Senior Staff Engineer to advance Die Attach technology across development, qualification, and industrialization phases. You will partner with cross-functional teams to deliver robust, manufacturable solutions aligned with project goals.

You will drive process innovation, apply DOE and data-driven methods, and mentor engineers while shaping future Die Attach architectures for advanced semiconductor packages and new product introductions.

Qualifications

• Master's or Bachelor's Degree in Engineering, Materials Science, Chemical Engineering, Semiconductor Technology, or a related technical discipline.
• 8+ years of experience in the semiconductor manufacturing industry, with strong exposure to assembly process development and semiconductor packaging technologies.
• Hands-on knowledge of semiconductor assembly processes, particularly Die Attach technologies, materials, equipment, and process integration.
• Strong analytical and problem-solving skills with the ability to diagnose complex process issues and drive effective corrective and preventive solutions.
• Experience with statistical analysis and data-driven decision-making, including DOE, process characterization, and process optimization methodologies.

Responsibilities

• Lead process development activities for Die Attach technologies, including process parameter scouting, optimization, verification, qualification, and process freeze to meet project objectives in quality, cost, manufacturability, and timeline.
• Drive technical handover and knowledge transfer activities from development to manufacturing operations, ensuring successful process implementation and production readiness.
• Support prototype builds, engineering samples, and development projects while ensuring process stability and technical compliance throughout the development cycle.
• Develop, maintain, and review technical documentation including Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, and other engineering records.
• Provide technical ownership and input for Process of Record (POR), Assembly Design Rules, Process Roadmaps, Control Plans, Failure Catalogues, and Maintenance Checklists.
• Collaborate with equipment, tooling, and material suppliers to evaluate, verify, qualify, and implement new technologies, machines, tooling solutions, and materials.
• Lead task forces and multidisciplinary teams in resolving complex manufacturing and process-related challenges using structured problem-solving methodologies and statistical tools.
• Identify and develop next-generation Die Attach process technologies and continuously improve process capability to support future business and product requirements.
• Support technology selection and definition activities involving materials, equipment platforms, tooling concepts, and process architectures.
• Provide technical coaching, mentorship, and guidance to engineers, project teams, and stakeholders on Die Attach process technologies and best practices.

Skills

Die Attach expertise

DOE

Statistical analysis

Problem-solving

Education

Master's or Bachelor's Degree in Engineering/Materials Science/related

Tools

DOE software

Process equipment knowledge

Job description

Infineon Technologies AG in Malaysia invites a Senior Staff Engineer to advance Die Attach technology across development, qualification, and industrialization phases. You will partner with cross-functional teams to deliver robust, manufacturable solutions aligned with project goals.

You will drive process innovation, apply DOE and data-driven methods, and mentor engineers while shaping future Die Attach architectures for advanced semiconductor packages and new product introductions.