Senior AI Hardware Lead: Failure Analysis & CAPA

Celestica; Kedah; On-site; MYR 180,000 - 360,000; Full time

Job summary

Celestica Malaysia is seeking a Senior Lead Product Development for AI hardware to head a cross-functional taskforce across design, manufacturing, and QA teams. You will drive CAPA, DFx processes, and lead EVT/DVT/PVT planning for next-gen AI ASICs and high-density PCBs.

The role requires a strong background in semiconductor ICs/ASICs, manufacturing/test expertise, and leadership of technical teams across internal and supplier networks, based at Penang Design Centre.

Qualifications

• Extensive experience guiding cross-functional engineering teams.
• Proven CAPA governance and yield-improvement track record.
• Strong background in IC/ASIC design and test processes.

Responsibilities

• Lead cross-functional taskforces across Design, Manufacturing, Quality and Supply Chain.
• Drive DFM, DFA, and DFT reviews early in development to prevent bottlenecks.
• Oversee EVT/ DVT/ PVT planning and mass-production ramp activities.
• Lead deep-dive failure analysis and implement permanent CAPA across hardware.
• Coordinate with Product Management and suppliers for program success.

Skills

Leadership

CAPA

DFM/DFT/DFx

Root-cause analysis

Semiconductor ICs/ASICs

Education

Bachelor’s/Master’s in Electrical/Mechanical/Systems/Computer Engineering

Tools

EDA tools

PCB design

Job description

Celestica Malaysia is seeking a Senior Lead Product Development for AI hardware to head a cross-functional taskforce across design, manufacturing, and QA teams. You will drive CAPA, DFx processes, and lead EVT/DVT/PVT planning for next-gen AI ASICs and high-density PCBs.

The role requires a strong background in semiconductor ICs/ASICs, manufacturing/test expertise, and leadership of technical teams across internal and supplier networks, based at Penang Design Centre.