AI Hardware Product Lead Engineer

Celestica; Kulim; On-site; MYR 180,000 - 240,000; Full time

Job summary

Celestica in Kulim, Kedah, Malaysia seeks a Staff/Senior Lead Engineer for AI hardware products. You will lead a cross-functional taskforce of design, manufacturing, and supplier teams to perform deep-dive failure analysis and drive robust CAPA across the product lifecycle.

The role demands deep semiconductor IC/ASIC understanding, manufacturing/test process mastery, and leadership in NPI for next‑gen AI systems and high‑density PCBs.

Qualifications

• 10+ years of experience in Product Engineering, Hardware Engineering, or Technical Leadership driving failure analysis, CAPA, and yield improvement in high-tech manufacturing.
• Semiconductor ASIC expertise and deep understanding of IC architecture, physics, and failure modes.
• Design process mastery across manufacturing and test, with thorough schematic and board design knowledge.
• Strong analytical background in root-cause analysis, SPC, and yield analysis.
• Proven experience leading cross-functional task forces across internal teams, customers, suppliers, and IC vendors.

Responsibilities

• Lead deep-dive failure root-cause analysis and drive permanent CAPA.
• Spearhead Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews early in development.
• Own NP I process development and execution for next-gen AI ASICs and high-density PCBs.
• Oversee build planning (EVT/DVT/PVT), yield improvement, and mass-production ramp schedules.
• Serve as central technical contact across Product Management, Design Engineering, Supply Chain, Quality, and Manufacturing Operations.

Skills

Cross-functional Leadership

DFX Leadership

NPI Execution

Root Cause Analysis

AI Hardware Knowledge

Data-Driven Problem Solving

Education

Bachelor’s/Master’s in Electrical & Electronics Engineering

Job description

Celestica in Kulim, Kedah, Malaysia seeks a Staff/Senior Lead Engineer for AI hardware products. You will lead a cross-functional taskforce of design, manufacturing, and supplier teams to perform deep-dive failure analysis and drive robust CAPA across the product lifecycle.

The role demands deep semiconductor IC/ASIC understanding, manufacturing/test process mastery, and leadership in NPI for next‑gen AI systems and high‑density PCBs.