Senior Lead Product Development (AI Hardware)

Celestica; Kedah; On-site; MYR 180,000 - 360,000; Full time

Job summary

Celestica Malaysia is seeking a Senior Lead Product Development for AI hardware to head a cross-functional taskforce across design, manufacturing, and QA teams. You will drive CAPA, DFx processes, and lead EVT/DVT/PVT planning for next-gen AI ASICs and high-density PCBs.

The role requires a strong background in semiconductor ICs/ASICs, manufacturing/test expertise, and leadership of technical teams across internal and supplier networks, based at Penang Design Centre.

Qualifications

• Extensive experience guiding cross-functional engineering teams.
• Proven CAPA governance and yield-improvement track record.
• Strong background in IC/ASIC design and test processes.

Responsibilities

• Lead cross-functional taskforces across Design, Manufacturing, Quality and Supply Chain.
• Drive DFM, DFA, and DFT reviews early in development to prevent bottlenecks.
• Oversee EVT/ DVT/ PVT planning and mass-production ramp activities.
• Lead deep-dive failure analysis and implement permanent CAPA across hardware.
• Coordinate with Product Management and suppliers for program success.

Skills

Leadership

CAPA

DFM/DFT/DFx

Root-cause analysis

Semiconductor ICs/ASICs

Education

Bachelor’s/Master’s in Electrical/Mechanical/Systems/Computer Engineering

Tools

EDA tools

PCB design

Job description

Senior Lead Product Development (AI Hardware)

We are seeking a high-caliber Staff / Senior Lead Engineer, AI Hardware Product, representing the manufacturing site. In this role, you will lead a taskforce of cross-functional experts from Design Team, Customer, key suppliers, manufacturing site Process/Test/Debug/Quality Engineering to perform deep-dive failure root cause analysis and drive robust Corrective and Preventive Actions (CAPA).

You are a rare technical hybrid possessing unique, multi-domain expertise: a deeper understanding of semiconductor ICs/ASICs than anyone in Design Team or manufacturing site; superior insight into manufacturing and test processes compared to Design Team, suppliers, or customers; and stronger mastery of design and schematics than anyone else at the manufacturing site.

Key responsibilities

• Rapidly assimilate new technologies, components, and architectural paradigms to assess technical feasibility, manufacturability, and commercial viability
• Collaborate closely with R&D, Hardware, Software, and Industrial Design teams to align product specifications with operational capabilities
• Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews early in the product development lifecycle to eliminate downstream operational bottlenecks
• Collaborate with Advanced Process Engineers to pioneer and optimize advanced manufacturing processes and test solutions for New Product Introduction (NPI) of next-generation products built on cutting-edge AI ASICs, high-density PCBs, and advanced high-speed connectors and cabling systems
• Lead build planning (EVT/DVT/PVT), yield improvement, product qualification, and mass-production ramp schedules across internal engineering and operations teams
• Spearhead deep-dive investigation of complex hardware, IC/ASIC, and component failure modes and implement permanent CAPA
• Serve as the central technical point of contact across Product Management, Design Engineering, Supply Chain, Quality, and Manufacturing Operations

About you

• Bachelor's or Master's degree in Electrical and Electronics Engineering, Mechanical Engineering, Systems Engineering, Computer Engineering, or a related technical discipline
• 10+ years of experience in Product Engineering, Hardware Engineering, or Technical Leadership driving failure analysis, CAPA, and yield improvement in high-tech manufacturing
• Superior understanding of semiconductor IC architecture, physics, and failure modes exceeding peer expertise in Design Team and manufacturing site
• Exceptional expertise in manufacturing and test processes, exceeding that of design engineers, suppliers, and customers, coupled with a comprehensive schematic and board design knowledge
• Strong analytical background skilled in root-cause analysis, statistical process control, and yield analysis
• Proven experience leading technical taskforces involving internal teams (Process, Test, Debug, Quality), Design Team, customers, and key IC vendors
• Deep understanding of AI Data Center architecture, current and emerging technologies surrounding hyperscaler AI servers, switches, and storage, while continuously keeping pace with future technology developments and market releases

Headquartered in Toronto, Celestica Inc. is a global leader in high-reliability design, manufacturing, and supply chain solutions. We enable major brands to launch complex products in markets like Aerospace, Defense, HealthTech, and Industrial, driving a smarter, sustainable future.

In 2023, Celestica expanded its footprint with a new Design Centre in Penang, Malaysia. This strategic hub collaborates with our global engineering teams to develop cutting-edge Hardware Platform Solutions. The Penang team focuses on next-gen Networking, Storage, and Server technologies to power Cloud, AI, Machine Learning, Edge, and 5G deployments worldwide.

Headquartered in Toronto, Celestica Inc. is a global leader in high-reliability design, manufacturing, and supply chain solutions. We enable major brands to launch complex products in markets like Aerospace, Defense, HealthTech, and Industrial, driving a smarter, sustainable future.

In 2023, Celestica expanded its footprint with a new Design Centre in Penang, Malaysia. This strategic hub collaborates with our global engineering teams to develop cutting-edge Hardware Platform Solutions. The Penang team focuses on next-gen Networking, Storage, and Server technologies to power Cloud, AI, Machine Learning, Edge, and 5G deployments worldwide.