Semiconductor Back-End Process Engineer: Die & Wire Bonding

Renesas Electronics Corp.; Subang Jaya; On-site; MYR 60,000 - 90,000; Full time

Job summary

Renesas Electronics Corp. in Subang Jaya is seeking a Process Engineer with hands-on back-end semiconductor experience, focusing on die bonding and wire bonding.

You will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance. The ideal candidate understands back-end equipment, materials, and process interactions, and can collaborate with manufacturing teams to drive continuous improvement and robust

Qualifications

• Minimum 2 years of hands-on experience in semiconductor back-end assembly.
• Experience with die bonding and wire bonding processes.
• Strong understanding of back-end equipment and materials.

Responsibilities

• Set up and optimize semiconductor back-end processes to improve yield and quality.
• Troubleshoot process issues to ensure stable manufacturing performance.

Skills

Die bonding

Wire bonding

Process optimization

Job description

Renesas Electronics Corp. in Subang Jaya is seeking a Process Engineer with hands-on back-end semiconductor experience, focusing on die bonding and wire bonding.

You will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance. The ideal candidate understands back-end equipment, materials, and process interactions, and can collaborate with manufacturing teams to drive continuous improvement and robust