R-D Manager - Frontend-Backend

Executive Compass; Kulim; On-site; MYR 180,000 - 320,000; Full time

Job summary

Jora Malaysia is seeking an experienced leader to drive development engineering and industrialization of IC substrate products in Kulim, Malaysia. You will guide technology development, transfer from R&D, and lead NPI and ramp-up with strong cross-functional collaboration.

The role requires 10+ years in semiconductor/high-tech electronics manufacturing, with 3–5 years in a managerial capacity, and a proven track record in PCB/IC substrate domains.

Qualifications

• Bachelor's or Master's degree in Electrical/ Electronics/ Mechanical/ Materials/ Chemical/ Manufacturing Engineering or related discipline.
• 10+ years of relevant experience in semiconductor, IC substrate, PCB, advanced packaging or high-tech electronics manufacturing.
• 3–5 years in a managerial/leadership position managing engineering or technology development teams.
• Experience with IC substrates, PCB, semiconductor is highly preferred.

Responsibilities

• Lead and manage the development engineering team, including technology development, process development and industrialization activities.
• Drive the development and industrialization of new IC substrate products, technologies, materials, equipment and manufacturing processes.
• Lead technology transfer from R&D / other sites into the Malaysia manufacturing site.
• Define and execute technology roadmaps in alignment with customer requirements and business objectives.
• Manage NPI, technology qualification and product/process ramp-up activities.
• Ensure projects are delivered according to agreed timelines, quality requirements, technical specifications and cost targets.
• Lead cross-functional teams to resolve technical, process and manufacturing issues during NPI and production ramp-up.
• Work closely with customers on technical requirements, product specifications, qualification plans and technical reviews.
• Coordinate with suppliers and internal engineering teams on new materials, equipment and process technologies.
• Identify technology gaps and establish action plans to close gaps against customer and product requirements.
• Drive process capability, yield improvement, reliability and manufacturing robustness during industrialization.
• Establish and monitor key technology and engineering KPIs.
• Lead root-cause analysis and corrective actions for complex technical/process issues.
• Ensure proper documentation of process parameters, specifications, qualification results and engineering standards.
• Support customer audits, technical reviews and qualification activities.

Skills

Leadership experience

Technology development

NPI

Industrialization

Project management

Cross-functional collaboration

Documentation & QA

Customer interaction

Process development

Reliability & yield improvement

Education

Bachelor's or Master's in engineering related field

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

• Lead and manage the development engineering team, including technology development, process development and industrialization activities.
• Drive the development and industrialization of new IC substrate products, technologies, materials, equipment and manufacturing processes.
• Lead technology transfer from R&D / other sites into the Malaysia manufacturing site.
• Define and execute technology roadmaps in alignment with customer requirements and business objectives.
• Manage NPI, technology qualification and product/process ramp-up activities.
• Ensure projects are delivered according to agreed timelines, quality requirements, technical specifications and cost targets.
• Lead cross-functional teams to resolve technical, process and manufacturing issues during NPI and production ramp-up.
• Work closely with customers on technical requirements, product specifications, qualification plans and technical reviews.
• Coordinate with suppliers and internal engineering teams on new materials, equipment and process technologies.
• Identify technology gaps and establish action plans to close gaps against customer and product requirements.
• Drive process capability, yield improvement, reliability and manufacturing robustness during industrialization.
• Establish and monitor key technology and engineering KPIs.
• Lead root-cause analysis and corrective actions for complex technical/process issues.
• Ensure proper documentation of process parameters, specifications, qualification results and engineering standards.
• Support customer audits, technical reviews and qualification activities.

Candidate Requirements

• Bachelor's or Master's Degree in Electrical Engineering, Electronics, Mechanical Engineering, Materials Science, Chemical Engineering, Manufacturing Engineering, Semiconductor Engineering or a related discipline.
• Minimum 10+ years of relevant experience in semiconductor, IC substrate, PCB, advanced packaging or high-tech electronics manufacturing.
• At least 3-5 years in a managerial / leadership position managing engineering or technology development teams.
• Strong experience in technology development, process development, NPI and industrialization.
• Experience with IC substrates, PCB, semiconductor is highly preferred.