Quality & Reliability Engineer — Advanced Packaging

Intel; Penang; On-site; MYR 180,000 - 300,000; Full time

Job summary

Intel is seeking a Manufacturing Quality and Reliability Engineer in Penang to support advanced packaging programs (EMIB, Foveros). The role spans wafer-level assembly and packaging, collaborating across fab, substrates, test, and process engineering to ensure quality and reliability from wafer fabrication to final assembly.

Responsibilities include driving root-cause analyses, implementing 8D actions, and enhancing control plans, SPC, and excursion prevention.

Qualifications

• Bachelor's or Master's degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field with relevant semiconductor manufacturing experience.
• At least 3 years in semiconductor manufacturing (WLA, Die prep, packaging Substrates) with a bachelor's degree.
• Experience in quality and reliability methodologies, excursion management, and failure mode analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Familiar with QnR Quality Systems and tools.
• Effective verbal and written communication, and meetings skills.

Responsibilities

• Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications.
• Collaborate with cross-functional teams to drive root cause analysis and 8D-based corrective and preventive actions.
• Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection and in-line controls.
• Drive quality control improvements using SPC, Pareto analysis, control plans, and excursion indicators across fab, substrate, and assembly steps.
• Support excursion management including MRB facilitation, containment strategies, rapid risk assessment, and clear communication with Foundry partners and Intel customers.
• Provide input on thermomechanical interactions between wafer, die, and package for risk assessment and technical decisions.
• Own and improve material disposition RFCs and QA/QC monitoring tools.
• Support certification and transfer activities with technology development and ramp partners.
• Use data extraction and scripting to flag risks and anomalies; represent the voice of the customer in internal forums.

Skills

Quality & Reliability

Statistical analysis

Root cause analysis

8D problem solving

Data analytics

Communication

Education

Bachelor's or Master's in Materials Science/Physics/Chemical/Mechanical engineering

Tools

QnR Quality Systems

Statistical analysis software

Job description

Intel is seeking a Manufacturing Quality and Reliability Engineer in Penang to support advanced packaging programs (EMIB, Foveros). The role spans wafer-level assembly and packaging, collaborating across fab, substrates, test, and process engineering to ensure quality and reliability from wafer fabrication to final assembly.

Responsibilities include driving root-cause analyses, implementing 8D actions, and enhancing control plans, SPC, and excursion prevention.