Quality & Reliability Engineer, Semiconductor Packaging

Intel Corporation; Seberang Perai; Hybrid; MYR 120,000 - 160,000; Full time

Job summary

Intel Corporation in Malaysia (Penang) seeks a Manufacturing Quality and Reliability Engineer to support C4 bumping and interconnect quality from wafer fabrication through packaging. You will drive MRB processes, lead cross-functional investigations, and apply statistics and data mining to ensure top-tier reliability across wafer, die, and package levels.

Join a team advancing cutting-edge packaging technology with a focus on process containment, defect reduction, and proactive quality

Qualifications

• Master's degree in a relevant field with semiconductor manufacturing experience
• 5+ years in semiconductor manufacturing, C4 bumping, and chip assembly
• Experience with solder joint reliability and excursion management
• Proficiency in statistics and data analytics tools
• Experience with data mining to extract insights from structured and unstructured data
• Familiar with QnR Quality Systems and tools
• Strong communication and meeting skills
• Self-driven with a culture of quality and zero defects

Responsibilities

• Chair MRB meetings and drive containment strategies
• Provide input on solder joint reliability and thermomechanical interactions
• Collaborate with cross-functional teams for root cause and corrective actions
• Develop systems for early detection and containment of excursions
• Own material disposition RFCs and eDispo screens
• Support factory operations and ramp activities
• Use data extraction tools and scripting to analyze inline, EOL, and reliability data
• Extract insights from data to determine product disposition

Skills

Data analytics

Data mining

Solder reliability

MRB management

Communication skills

Scripting basics

Education

Master's degree in Material Science/Physics/Chemical Engineering/Mechanical Engineering

Bachelor's degree in a related field

Tools

QnR quality systems

Job description

Intel Corporation in Malaysia (Penang) seeks a Manufacturing Quality and Reliability Engineer to support C4 bumping and interconnect quality from wafer fabrication through packaging. You will drive MRB processes, lead cross-functional investigations, and apply statistics and data mining to ensure top-tier reliability across wafer, die, and package levels.

Join a team advancing cutting-edge packaging technology with a focus on process containment, defect reduction, and proactive quality