Process Engineer – PQFN & Cu Clip Assembly

Renesas Electronics (Malaysia)

Hang Tuah Jaya

In loco

MYR 90.000 - 120.000

Tempo pieno

6 giorni fa

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Descrizione del lavoro

Renesas Electronics is seeking an experienced Assembly Engineer to qualify PQFN packages for Smart Power Stage products and related modules. You will help ramp up volume, qualify sources, and sustain line performance by improving yield, capacity and costs.

Candidates should have at least 5 years of assembly engineering experience, with knowledge of PQFN/QFN and wire bonding, and strong English communication and analytical skills for cross-functional collaboration.

Competenze

Degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences.
Minimum 5 years of experience in Assembly Engineering.
Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.

Mansioni

Design package and develop processes to qualify PQFN packages for SPS products and related modules.
Ramp up manufacturing volume and qualify required sources.
Improve assembly yield, capacity, quality and costs; sustain line performance.