Engineer, Process Development Engineering

1326 Analog Devices Manufacturing (Malaysia) Sdn. Bhd.; Penang; On-site; MYR 60,000 - 100,000; Full time

Job summary

Analog Devices in Penang seeks an experienced Semiconductor Packaging Engineer to develop, qualify, and optimize Die Attach and Flip Chip assembly processes for high-volume manufacturing. You will provide production support, perform DOE, and collaborate with equipment, materials, and product teams to drive yield, reliability, and process documentation while upholding quality standards.

The role emphasizes continuous improvement and transfer of processes from development to manufacturing with

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 3–10 years of experience in semiconductor packaging or assembly manufacturing.
• Hands-on experience with Die Attach and Flip Chip processes in a production environment.
• Strong knowledge of die bonding techniques, flip chip assembly, underfill, and solder bump/micro-bump technology.
• Familiarity with reliability testing and failure analysis.

Responsibilities

• Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
• Provide process engineering support for production lines, including troubleshooting yield and quality issues.
• Perform DOE and process characterization to improve performance and reliability.
• Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
• Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
• Establish and maintain process documentation, specifications, and control plans.
• Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
• Interface with equipment vendors and material suppliers to qualify new technologies and improvements.
• Ensure compliance with quality standards and manufacturing best practices.

Skills

Problem-solving

Cross-functional collaboration

Communication skills

Education

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering

Tools

Die Attach equipment

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

1. Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
2. Provide process engineering support for production lines, including troubleshooting yield and quality issues.
3. Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
4. Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
5. Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
6. Establish and maintain process documentation, specifications, and control plans.
7. Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
8. Analyze failure modes and reliability concerns related to die attach and flip chip processes.
9. Interface with equipment vendors and material suppliers to qualify new technologies and improvements.
10. Ensure compliance with quality standards and manufacturing best practices.

Qualifications

1. Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
2. 3–10 years of experience in semiconductor packaging or assembly manufacturing.
3. Hands-on experience with Die Attach and Flip Chip processes in a production environment.
4. Strong knowledge of:
   • a. Die bonding techniques
   • b. Flip chip assembly
   • c. Underfill processes
   • d. Solder bump / micro-bump technology
   • e. Familiarity with advanced packaging technologies is an advantage (e.g., WLCSP, BGA, SiP, 2.5D/3D packaging).
5. Strong problem-solving and cross-functional communication skills.
6. Experience with die attach equipment (ASM, BESI, Datacon, etc.).
7. Familiarity with reliability testing and failure analysis.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: Normal Time (Philippines)

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. Come join ADI – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.