NPI Wafer Dicing Process Engineer — Lead & Innovate
Carsem
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Job summary
Carsem in Ipoh, Malaysia is seeking a Senior Process Engineer specializing in NPI and wafer dicing. You will lead the cassette and wafer sawing for new product introductions, optimize blade selection, spindle speed, feed rate and depths to hit yield and quality targets, and drive CAPA-driven improvements.
You will collaborate across Process Eng, Equipment Eng, QA, Production Planning and NPI Program Management to ensure timely delivery, robust documentation, and continuous improvement throughout
Qualifications
- Minimum 5–8 years in semiconductor manufacturing.
- At least 3 years in NPI, wafer sawing/dicing process engineering or similar role.
- Experience with wafer dicing equipment (DISCO, ADT, Synova) preferred.
- Familiarity with DOE, SPC, FMEA, 8D, Six Sigma and statistical analysis.
Responsibilities
- Lead wafer sawing process for NPI projects from evaluation through qualification and release.
- Develop, optimize, and validate sawing process parameters to achieve yield and quality targets.
- Conduct CAPA to resolve wafer-related issues like chipping or yield loss.
- Plan DOE and process characterization to evaluate materials and advanced dicing methods.
- Support equipment qualification and buy-off for new product introductions.
- Collaborate with PFMEA, QA, Production and NPI teams to mitigate risk and ensure timely delivery.
- Prepare SOPs, work instructions, and control plans; monitor OEE, UPH, cycle time, downtime.
Skills
Tools
Job description
Carsem in Ipoh, Malaysia is seeking a Senior Process Engineer specializing in NPI and wafer dicing. You will lead the cassette and wafer sawing for new product introductions, optimize blade selection, spindle speed, feed rate and depths to hit yield and quality targets, and drive CAPA-driven improvements.
You will collaborate across Process Eng, Equipment Eng, QA, Production Planning and NPI Program Management to ensure timely delivery, robust documentation, and continuous improvement throughout
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